Amabhodi Esekethe Aphrintiwe Ama-multilayer

Ibhodi Lesifunda Eliphrintiwe (PCB), elaziwa nangokuthi Ibhodi Lesifunda Eliphrintiwe noma Ibhodi Lesifunda Eliphrintiwe. Amabhodi aphrintiwe we-Multilayer abhekisela kumabhodi aphrintiwe anezendlalelo ezingaphezu kwezimbili, ezakhiwe izintambo ezixhumayo ezingqimbeni eziningana ze-insulating substrates nama-solder pads asetshenziselwa ukuhlanganisa nokushisela izingxenye ze-electronic. Abagcini nje ngokuba nomsebenzi wokuqhuba izifunda zesendlalelo ngasinye, kodwa futhi banomsebenzi wokubambisana.

Ibhodi le-PCB lezendlalelo eziningi libhekisela ebhodini lesekethe elinezingqimba eziningi elisetshenziswa emikhiqizweni kagesi, esebenzisa amabhodi ezintambo amaningi anezinhlangothi ezimbili. Ibhodi lesifunda eliphrintiwe elisebenzisa ungqimba lwangaphakathi olunezinhlangothi ezimbili, izendlalelo zangaphandle ezimbili ezinohlangothi olulodwa, noma izendlalelo zangaphakathi ezinohlangothi olukabili, nezingqimba ezimbili zangaphandle ezinohlangothi olulodwa, futhi lixhunywe nemifanekiso eqhubayo ngokuya ngezidingo zedizayini ngezinhlelo zokubeka indawo nezinto zokubopha ezivikelayo, liba yibhodi lesifunda eliphrintiwe elinezingqimba ezine noma eziyisithupha, elaziwa nangokuthi ibhodi lesifunda elinezingqimba eziningi.

Xhumana nathi

imininingwane yomkhiqizo

Izici ze-PCB Multilayer Board

Umehluko omkhulu phakathi kwebhodi le-PCB yezingqimba eziningi kanye nephaneli eyodwa noma ekabili ukwengezwa kongqimba lwamandla angaphakathi (ukugcina ungqimba lwamandla angaphakathi) kanye nongqimba oluphansi. Inethiwekhi yamandla nephansi inezintambo ikakhulukazi isendlalelo samandla. Kodwa-ke, izintambo zebhodi lezingqimba eziningi ngokuyinhloko zisekelwe phezu kwezingqimba ezingaphezulu nezingaphansi, zengezwe ungqimba oluphakathi lwezintambo. Ngakho-ke, indlela yokuklama yamabhodi anezingqimba eziningi ngokuyisisekelo iyafana neyamabhodi anezinhlangothi ezimbili, futhi isihluthulelo sisendleleni yokwandisa izintambo zesendlalelo sikagesi sangaphakathi ukuze kwenziwe izintambo zebhodi lesifunda zibe nengqondo futhi zibe nokuhambisana okungcono kwe-electromagnetic.

Ukugeleza Kwenqubo ye-PCB Multilayer Board

ukugeleza kwenqubo

Ibhodi lesifunda eliphrintiwe elinezithombe eziqediwe → ukususwa kwe-asidi → ukuskena ukugeza amanzi → ukuwashwa kwamanzi okwesibili → ukuchotshozwa okuncane → ukuwasha amanzi okuskena → ukuwasha amanzi okwesibili okuphambene nalokho → ucwecwe lwe-copper prepreg → ucwecwe lwe-copper → ukuwasha amanzi okuskena → ibhodi lokugeza ithini → ibhodi lokuwasha eliphansi eliphansi

Umehluko phakathi kwebhodi le-PCB elinezinhlangothi ezimbili kanye nebhodi le-PCB elinohlangothi olulodwa ukuthi isekethe yephaneli eyodwa kuphela ohlangothini olulodwa lwebhodi le-PCB, kuyilapho umjikelezo webhodi le-PCB elinamacala amabili ungaxhunywa phakathi kwezinhlangothi ezimbili zebhodi le-PCB ngembobo edlula phakathi nendawo.

imingcele yomkhiqizo

Isici	Imininingwane yezobuchwepheshe ye-AREX
Inani lezendlalelo	Izingqimba ezi-4 - 22 ezijwayelekile, izendlalelo ezingama-30 zithuthukile, i-prototype yezendlalelo ezingama-40.
Amaphuzu avelele ezobuchwepheshe	Izendlalelo eziningi ze-epoxy glass fiber ezihlanganiswe ndawonye nezingqimba eziningi zethusi ezinobukhulu obuhlukahlukene.
Izinto zokwakha	Ukusebenza okuphezulu kwe-FR4, i-FR4 ye-halogen-free, ukulahlekelwa okuphansi nezinto ezisetshenziswayo eziphansi zika-D
Izisindo zethusi (ziqediwe)	18μm – 210μm, eziphambili 1050μm / 30oz
Ithrekhi negebe elincane	0.075mm / 0.075mm
Ubukhulu be-PCB	0.40mm – 7.0mm
Ubukhulu obukhulu bobukhulu	580mm x 1080mm, ethuthukisiwe 610mm x 1400mm
Ukuqedwa kobuso kuyatholakala	I-HASL (SnPb), i-LF HASL (SnNiCu), i-OSP, i-ENIG, i-Immersion Tin, i-Immersion Silver, igolide le-Electrolytic, iminwe yegolide
Ubuncane bokuprakthiza komshini	0.20mm
Ubuncane be-laser drill	0.10mm ejwayelekile, 0.075mm ethuthukisiwe