I-IMS – I-Insulated Metal Base Printed Circuit Boards

Isisekelo se-insulation sensimbi sakhiwe ungqimba oluyisisekelo lwensimbi, ungqimba olufakwa ngaphakathi, kanye nongqimba lwesekethe olugqoke ithusi. Kuyinsimbi yebhodi lesekethe yensimbi eyingxenye yezingxenye ezijwayelekile ze-elekthronikhi, ehlanganisa ungqimba olushisayo, ipuleti lensimbi, nefoil yensimbi. Ine-conductivity kazibuthe ekhethekile, i-heat dissipation enhle kakhulu, amandla aphezulu emishini, nokusebenza okuhle kokucubungula.

I-substrate ye-insulation ye-metal yakhiwe ungqimba lwe-metal substrate, ungqimba lokufakwa kwe-insulation, kanye nongqimba lwesekethe olugqoke ithusi. Ungqimba olungaphezulu luyingqimba yesekethe ye-copper clad, ekuqaleni equkethe ungqimba lwethusi. Ngokwezidingo zokuxhunywa kukagesi, isekethe ingagqwala ibe yisekethe edingekayo. I-transistor core yamandla, i-chip control chip, njll. ingadayiswa ngokuqondile kungqimba lwesekethe ye-copper clad. Ukuze kube lula ukushisela nokuvimbela i-oxidation, i-solder pad ihlanganiswe ne-Ti, Pt, Cu, Au namanye amafilimu amancane egolide, anobukhulu obuyi-35, 50, 70105140 microns; Isendlalelo esimaphakathi siwungqimba ophakathi nendawo ovikelayo, ngokuvamile owenziwe ngendwangu yendwangu yengilazi ye-epoxy ene-thermal conductivity, i-epoxy resin, noma ifilimu ye-organic dielectric egcwele izinto zobumba. Ubukhulu bayo buhlukaniswe ngemininingwane emine: 50, 75, 100, 150 microns.