I-HDI PCB High Density Interconnect PCB

I-HDI PCB (i-High Density Interconnect PCB) iyibhodi lesifunda elixhumanisa abantu abaningi elisetshenziselwa ukuzuza ukuxhumana okwengeziwe nokuminyana okuphezulu endaweni elinganiselwe. Ngokuvamile isetshenziswa kumadivayisi kagesi ayinkimbinkimbi njengama-smartphone, amaphilisi, namakhompyutha.

Ibhodi lesifunda le-HDI PCB lamukela uchungechunge lobuchwepheshe bokukhiqiza obuthuthukisiwe, obufana namasekhethi amancane, izimbobo ezingcwatshwe izimpumputhe, izimbangi ezishumekiwe, nokuxhumana kwama-interlayer. Lobu buchwepheshe buvumela ama-HDI PCBs ukuthi afinyelele ukuminyana okuphezulu kokuxhumeka kanye nemiklamo eyinkimbinkimbi yesekethe ngamasayizi amancane uma kuqhathaniswa.

Ngenxa yenqubo yokukhiqiza kanye nezidingo zokunemba okuphezulu kwamabhodi wesekethe we-HDI PCB, izindleko zokukhiqiza ze-HDI PCB ngokuvamile ziba phezulu uma ziqhathaniswa namabhodi esekethe avamile. Lokhu kungenxa yokuthi ama-HDI PCB adinga ukusetshenziswa kwezinqubo eziyinkimbinkimbi nemishini ethuthukisiwe ukuze kuzuzwe ukuminyana kwawo okuphezulu nokuba yinkimbinkimbi.

Ngaphezu kwalokho, ukuklanywa nokuhlelwa kwamabhodi wesekethe we-HDI PCB nakho kudinga izinsiza eziningi zonjiniyela kanye nokutshalwa kwezimali kwesikhathi ukuze kuqinisekiswe ukwethembeka nokusebenza kwesekethe.

Ngakho-ke, ngokuvamile, izindleko zokukhiqiza zamabhodi wesifunda we-HDI PCB ziphakeme kunalezo zamabhodi wesifunda wendabuko. Nokho, izici ezithile ezithonya izindleko nazo zithonywa ezinye izici eziningi, njengenani elidingekayo lezendlalelo, ububanzi bomugqa/isikhala, izidingo zokuvula, njll.

Xhumana nathi

imininingwane yomkhiqizo

isingeniso somkhiqizo

I-HDI PCB ifanele imikhiqizo esebenza ngogesi ebalulekile kanye nokucindezelwa komsindo. Izinzuzo HDI PCB zihlanganisa
Ubuchwepheshe be-HDI bunciphisa usayizi ophelele womkhiqizo futhi buthuthukisa ukusebenza kukagesi.
Ukulawulwa okuqinile kwe-impedance kanye nekhono lokudlulisela elivela kumaza aphezulu

Ukusetshenziswa kwebhodi lesifunda eliphrintiwe le-HDI PCB

● Ukushintsha ibhethri
● Umsabalalisi wamandla
● Ukulawulwa kwezimoto

Ukulawulwa kohlelo lokusebenza lwe-LED

● Imikhiqizo yezimoto, yezimboni, yezokuxhumana ngogesi
● Amasathelayithi, amasistimu amancane

Inqubo ekhethekile ye-HDI PCB

Ukulawulwa kwe-impedance

Lawula ivelu yokuvimbela ye-conductor ku-PCB enesivinini esiphezulu ngaphakathi kwebanga elithile ukuze uhlangabezane nezimfuneko zokudlulisa idatha.

Ukuprakthiza emuva

Ukubhola emuva kuyinqubo yokwenza izimbobo ngokususa izindlela ezinqamulelayo kumabhodi esekethe aphrintelwe izendlalelo eziningi.

Inqubo ekhethekile yokulawula ukubhoboza okujulile ukugeleza amasignali kusuka kungqimba olulodwa lwebhodi kuya kwesinye.

Ngembobo kuphedi

I-Via in pad iyinqubo esetshenziswa kabanzi ukuzivumelanisa nobuchwepheshe bokuxhumana obunokuminyana okuphezulu. I-Via in pad ingeye-electroplating

Izimbobo zingaqondwa kalula njengezimbobo kuma-BGA pads.

Isici	Imininingwane yezobuchwepheshe ye-AREX
Inombolo yezendlalelo	4 - 22 izendlalelo ezijwayelekile, izendlalelo ezingama-30 zithuthukile
Amaphuzu avelele ezobuchwepheshe	Amabhodi e-multilayer anomthamo wephedi yokuxhumana ephakeme kunamabhodi ajwayelekile, anemigqa/izikhala ezicolekile, amancane ngezimbobo namaphedi wokuthwebula avumela ama-microvias ukuthi angene kuphela izendlalelo ezikhethiwe futhi abekwe kumaphedi angaphezulu.
I-HDI iyakha	1+N+1, 2+N+2, 3+N+3,4+N+4, noma yisiphi isendlalelo / i-ELIC, i-Ultra HDI ku-R&D
Izinto zokwakha	I-FR4 ejwayelekile, ukusebenza okuphezulu kwe-FR4, i-Halogen yamahhala FR4, i-Rogers
Izisindo zethusi (ziqediwe)	18μm – 70μm
Ithrekhi negebe elincane	0.075mm / 0.075mm
Ubukhulu be-PCB	0.40mm – 3.20mm
Ubukhulu obukhulu bobukhulu	610mm x 450mm; kuncike emshinini wokumba we-laser
Ukuqedwa kobuso kuyatholakala	I-OSP, i-ENIG, ithini lokucwiliswa, isiliva lokucwiliswa, igolide le-Electrolytic, iminwe yegolide
Ubuncane bokuprakthiza komshini	0.15mm
Ubuncane be-laser drill	0.10mm ejwayelekile, 0.075mm ethuthukisiwe