Iibhodi zeSekethe eziprintiweyo ezininzi

Ibhodi yeSekethe eprintiweyo (PCB), eyaziwa ngokuba yiBhodi yeSekethe eShicileleyo okanye iBhodi yeSekethe eShicileleyo. Iibhodi eziprintiweyo ezininzi zibhekiselele kwiibhodi eziprintiweyo ezinemigangatho engaphezu kwembini, equlunqwe ngeengcingo ezidibanisayo kwimigangatho emininzi ye-insulating substrates kunye ne-solder pads ezisetyenziselwa ukudibanisa kunye nokuwelda amacandelo e-elektroniki. Abanayo nje umsebenzi wokuqhuba iisekethe zoluhlu ngalunye, kodwa banomsebenzi wokubambisana.

Ibhodi ye-PCB ye-multilayer ibhekisela kwibhodi yesekethe ye-multi-layer esetyenziswa kwiimveliso zombane, esebenzisa iibhodi zocingo ezingaphezulu okanye eziphindwe kabini. Ibhodi yesekethe eprintiweyo esebenzisa umaleko wangaphakathi onamacala amabini, umaleko ongaphandle onamacala amabini, okanye izaleko ezimbini zangaphakathi ezinamacala amabini, kunye nemigangatho emibini engaphandle, kwaye idityaniswe nemizobo eqhubayo ngokweemfuno zoyilo ngokwenkqubo yokubeka kunye nezixhobo zokugquma, iba yibhodi yesekethe eprintiweyo emine okanye emithandathu, eyaziwa ngokuba yibhodi yesekethe eprintiweyo.

Qhagamshelana nathi

iinkcukacha zemveliso

Iimpawu zePCB yeBhodi yaMathala amaninzi

Owona mahluko mkhulu phakathi kwebhodi yePCB yomaleko emininzi kunye nephaneli enye okanye kabini kukongeza umaleko wamandla wangaphakathi (ukugcina umaleko wamandla wangaphakathi) kunye nomgangatho womhlaba. Amandla kunye nomhlaba womnatha wothungelwano lutsalwa kakhulu kwintambo yamandla. Nangona kunjalo, i-wiring yebhodi ye-multi-layer isekelwe ikakhulu kwimigangatho ephezulu kunye nesezantsi, eyongezwa ngoluhlu lwe-wiring ephakathi. Ke ngoko, indlela yoyilo lweebhodi ezinomaleko amaninzi ngokusisiseko iyafana naleyo yeebhodi ezinamacala amabini, kwaye isitshixo silele kwindlela yokwandisa i-wiring yocweyo lwangaphakathi lombane ukwenza i-wiring yebhodi yesekethe ibe nengqiqo kwaye ibe ngcono ukuhambelana kwe-electromagnetic.

Ukuqukuqela kweNkqubo yeBhodi ye-PCB yaMathala amaninzi

inkqubo yokuhamba

Ibhodi yesekethe eprintiweyo ephezulu enemizobo egqityiweyo → ukususwa kweasidi → ukuskena ukuvaswa kwamanzi → ukuhlamba amanzi okwesibini → ukucofa okuncinci → ukuskena ukuvasa amanzi → ukuhlamba amanzi okwesibini okuphindiweyo → ukucolwa kobhedu prepreg → ukucolwa kobhedu → ukucocwa kwamanzi okuhlambela → iplanga yenkcenkceza yamanzi esezantsi → ibhodi yokuhlambela esezantsi

Umahluko phakathi kwebhodi yePCB enamacala amabini kunye nebhodi yePCB enecala elinye kukuba isekethe yephaneli enye ikwicala elinye kuphela lebhodi yePCB, ngelixa isekethe yebhodi yePCB enamacala amabini inokudityaniswa phakathi kwamacala amabini ebhodi yePCB ngomngxuma phakathi.

imveliso parameters

Uphawu	Iimpawu zobuchwephesha ze-AREX
Inani leeleya	4 – 22 umaleko umgangatho, 30 umaleko phambili, 40 umaleko prototype.
Iimpawu eziphambili zetekhnoloji	Iileya ezininzi ze-epoxy glass fiber ezidityaniswe kunye neeleya ezininzi zobhedu ezinobunzima obahlukeneyo.
Izinto eziphathekayo	Ukusebenza okuphezulu kwe-FR4, i-halogen-free FR4, ilahleko ephantsi kunye nezinto eziphantsi Dk
Iintsimbi zobhedu (zigqityiwe)	18μm - 210μm, phambili 1050μm / 30oz
Ubuncinci bomzila kunye nesikhewu	0.075mm / 0.075mm
PCB ubukhulu	0.40mm - 7.0mm
Ubukhulu bemilinganiselo	580mm x 1080mm, phambili 610mm x 1400mm
Umphezulu ogqityiweyo uyafumaneka	HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, iTin yokuntywiliselwa, iSilver yokuntywiliselwa, igolide ye-Electrolytic, iminwe yeGolide
Ubuncinci be-drill yoomatshini	0.20mm
Ubuncinci be-laser drill	0.10mm umgangatho, 0.075mm phambili