I-IMS – Iibhodi zeSekethe eziprintiweyo zeMetal Base

Isiseko se-insulation sesinyithi siqulunqwe ngumaleko wesiseko sesinyithi, umaleko wokugquma, kunye nomgangatho wesekethe owenziwe ngobhedu. Yimathiriyeli yebhodi yesekethe yentsimbi eyeyamalungu ngokubanzi e-elektroniki, ebandakanya umaleko wokugquma we-thermal, ipleyiti yesinyithi, kunye nefoyile yentsimbi. Ine-conductivity ekhethekileyo yamagnetic, ukuchithwa kobushushu okugqwesileyo, amandla aphezulu omatshini, kunye nokusebenza kakuhle kokusebenza.

I-metal insulation substrate yenziwe nge-metal substrate layer, i-insulation layer, kunye ne-copper clad circuit layer. Uluhlu oluphezulu ngumaleko wesekethe owenziwe ngobhedu, oqale uqulathe umaleko wobhedu. Ngokweemfuno zokuxhunyelelwa kombane, isiphaluka sinokugqweswa kwisekethe efunekayo. I-core transistor yamandla, i-chip yokulawula umqhubi, njl. Ukuze kube lula ukuwelda kunye nokuthintela i-oxidation, i-solder pad ifakwe i-Ti, i-Pt, i-Cu, i-Au kunye nezinye iifilimu ezincinci zegolide, ezinobukhulu obuyi-35, 50, 70105140 microns; Umaleko ophakathi ngumaleko okhuselayo ophakathi, odla ngokwenziwa ngelaphu le-epoxy yeglasi yefiber encamathelayo eneconductivity entle ye-thermal, i-epoxy resin, okanye ifilimu ye-organic dielectric ezaliswe ngezinto ze-ceramic. Ubukhulu bayo buhlulwe ngokweenkcukacha ezine: 50, 75, 100, 150 microns.