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    HDI PCB High Density Interconnect PCB
    HDI PCB High Density Interconnect PCB
    HDI PCB High Density Interconnect PCB
    HDI PCB High Density Interconnect PCB

    HDI PCB High Density Interconnect PCB

    I-HDI PCB (i-High-Density Interconnect PCB) yibhodi yesekethe yoqhagamshelo olunoxinaniso oluphezulu olusetyenziselwa ukuphumeza uqhagamshelo oluninzi kunye noxinaniso oluphezulu kwindawo elinganiselweyo. Ngokuqhelekileyo isetyenziswa kwizixhobo zombane ezintsonkothileyo ezinjengee-smartphones, iitafile kunye neekhompyuter.


    Ibhodi yesekethe ye-HDI PCB yamkele uthotho lwetekhnoloji yokuvelisa ephucukileyo, enje ngeesekethe ezincinci, imingxuma engcwatywe iimfama, izichasi ezifakwe ngaphakathi, kunye nonxibelelwano lwe-interlayer. Ezi tekhnoloji zenza ukuba ii-HDI PCBs zifezekise ukuxinana koqhagamshelo oluphezulu kunye noyilo oluntsonkothileyo lwesekethe ngokweesayizi ezincinci.


    Ngenxa yenkqubo yokuvelisa kunye neemfuno ezichanekileyo ezichanekileyo zeebhodi zesekethe ze-HDI PCB, iindleko zokwenziwa kwe-HDI PCB zihlala ziphezulu xa kuthelekiswa neebhodi zesekethe eziqhelekileyo. Oku kungenxa yokuba ii-PCB ze-HDI zifuna ukusetyenziswa kweenkqubo ezintsonkothileyo kunye nezixhobo eziphambili ukuphumeza ukuxinana kwazo okuphezulu kunye nobunzima.


    Ukongeza, uyilo kunye nokubekwa kweebhodi zesekethe ze-HDI PCB nazo zifuna izixhobo ezininzi zobunjineli kunye nokutyalomali kwexesha lokuqinisekisa ukuthembeka kunye nokusebenza kwesekethe.

    Ke ngoko, ngokubanzi, iindleko zokwenziwa kweebhodi zesekethe ze-HDI PCB ziphezulu kuneebhodi zesekethe zemveli. Nangona kunjalo, iindleko ezithile ezichaphazelayo zikwaphenjelelwa zezinye izinto ezininzi, njengenani elifunekayo leeleya, ububanzi bomgca / isithuba, iimfuno zokuvula, njl.

      Qhagamshelana nathi
      iinkcukacha zemveliso

      ukwaziswa kwemveliso

      I-HDI PCB ifanelekile kwiimveliso ezinomsebenzi obalulekileyo wombane kunye nokunciphisa ingxolo. Iinzuzo HDI PCB ziquka
      Ubuchwephesha be-HDI bunciphisa ubukhulu bemveliso kunye nokuphucula ukusebenza kombane.
      Ulawulo oluluqilima lwe-impedance kunye nokukwazi ukuhanjiswa kwe-high-frequency transmission

      Ukusetyenziswa kweBhodi yeSekethe eprintiweyo ye-HDI PCB

      ● Ukutshintsha ibhetri
      ● Umsasazi wamandla
      ● Ulawulo lweemoto

      Ulawulo lwesicelo se-LED
      ● Iimveliso ze-auto, ishishini, unxibelelwano lwe-elektroniki
      ● Iisathelayithi, iinkqubo ezincinci

      Inkqubo ekhethekileyo ye-HDI PCB

      Ulawulo lwe-impedance
      Lawula ixabiso le-impedance ye-conductor kwi-PCB enesantya esiphezulu ngaphakathi koluhlu oluthile ukuhlangabezana neemfuno zokudluliselwa kwedatha.

      Ukuqhuba ngasemva

      Ukugrumba ngasemva yinkqubo yokwenza imingxunya ngokususa iindlela ezimfutshane kwiibhodi zesekethe eziprintiweyo ezininzi.
      Inkqubo ekhethekileyo yokulawula ukugrumba okunzulu kukuhamba kwemiqondiso ukusuka kwelinye ibhodi ukuya kwelinye.
      Ngomngxuma kwiphedi
      I-Via in pad yinkqubo esetyenziswa ngokubanzi ukulungelelanisa iteknoloji yoqhagamshelwano oluphezulu. Via in pad yeye electroplating
      Imingxunya inokuqondwa ngokulula njengemingxuma kwiipadi ze-BGA.
      HDI PCB High Density Interconnect PCB

      Uphawu

      Iimpawu zobuchwephesha ze-AREX

      Inani leeleya

      I-4 - 22 imigangatho yomgangatho, imigangatho engama-30 ihambele phambili

      Iimpawu eziphambili zetekhnoloji

      Iibhodi ezininzi ezinoxinaniso oluphezulu lwephedi yoqhagamshelo kuneebhodi eziqhelekileyo, ezinemigca/izithuba ezicikizekileyo, ezincinci ngemingxuma kunye neepads zokubamba ezivumela ii-microvias ukuba zingene kuphela kwiileya ezikhethiweyo kwaye zibekwe kwipads zomhlaba.

      HDI yakha

      1+N+1, 2+N+2, 3+N+3,4+N+4, naluphi na umaleko / ELIC, Ultra HDI kwi-R&D

      Izinto eziphathekayo

      FR4 umgangatho, FR4 ukusebenza eliphezulu, Halogen free FR4, Rogers

      Iintsimbi zobhedu (zigqityiwe)

      18μm - 70μm

      Ubuncinci bomzila kunye nesikhewu

      0.075mm / 0.075mm

      PCB ubukhulu

      0.40mm - 3.20mm

      Ubukhulu bemilinganiselo

      610mm x 450mm; ixhomekeke kumatshini wokomba welaser

      Umphezulu ogqityiweyo uyafumaneka

      OSP, ENIG, itoti yokuntywiliselwa, isilivere yokuntywiliselwa, igolide ye-Electrolytic, iminwe yeGolide

      Ubuncinci be-drill yoomatshini

      0.15mm

      Ubuncinci be-laser drill

      0.10mm umgangatho, 0.075mm phambili