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I-PCB sisishunqulelo sebhodi yesekethe eprintiweyo ngesiNgesi. Iisekethe eziprintiweyo zidla ngokubizwa ngokuba ziipateni zokuqhuba ezenziwe ngeesekethe eziprintiweyo, iikhomponenti eziprintiweyo, okanye indibaniselwano yezi zimbini, ngokusekwe kuyilo olumiselwe kwangaphambili kwizinto zokugquma. Ipatheni yokuqhuba enika uxhulumaniso lombane phakathi kwamacandelo kwi-substrate ye-insulating ibizwa ngokuba yisekethe eprintiweyo. Ngale ndlela, iisekethe eziprintiweyo okanye iibhodi ezigqityiweyo zeesekethe eziprintiweyo zibizwa ngokuba ziibhodi zeesekethe eziprintiweyo, ezaziwa ngokuba ziibhodi eziprintiweyo okanye iibhodi zeesekethe eziprintiweyo. Kwi-PCB esisiseko, iindawo zigxininiswe kwelinye icala kwaye iingcingo zigxininiswe kwelinye icala. Kuba iingcingo zivela kwicala elinye kuphela, silubiza olu hlobo lwePCB ngokuba yiPCB esecaleni elinye. Ngenxa yokuba ii-PCB ezisecaleni zinemida emininzi engqongqo kuyilo lwesekethe, njengoko zinecala elinye kuphela, i-wiring ayikwazi ukunqumla kwaye kufuneka ihanjiswe ngokuzimeleyo.

I-PCB eguquguqukayo isetyenziswe ngokubanzi kwimarike kwaye ibe yimveliso eyimfuneko kushishino lombane. Iyakwazi ukuziqhelanisa nezicelo ezahlukeneyo zeePCB eziguquguqukayo, ezifana nezixhobo ezinxitywayo, amalungu angengowamvelo, izixhobo zonyango, iimodyuli zeRFID, njl njl. I-PCB eguquguqukayo eqinile ithatha indawo yePCB eqinile, eyenziwe ngezinto zePCB kodwa eneempawu zokugoba. Indibaniselwano ye-PCB eqinile kwaye eguquguqukayo isetyenziselwa iifowuni eziphathwayo kunye neemveliso ezinxitywayo. Zombini ii-PCBs eziguquguqukayo ezithambileyo neziqinileyo zibonelela ngoyilo olomeleleyo kunye nokuguquguquka okongezelelweyo ukuhambisa okanye ukushukuma amacandelo emveliso.

IiPCB eziguquguqukayo ezingqongqo zinokugotshwa, ukugotywa, okanye ukungqukuva, emva koko zidityaniswe kwiimveliso ezahlukeneyo. Babonelela ngokulula, ukuguquguquka, kunye nokuhamba kwezixhobo eziphathwayo. Zibandakanya amakhadi okwandisa kunye neebhetri kwiilaptops okanye kwikhompyuter yedesktop. I-PCB eguquguqukayo ephakathi inokugotywa okanye igobe, kodwa ayiguquguquki njengebhodi eqinile yendibaniselwano ebhetyebhetye. Zikwasisisombululo esisebenzayo sesixhobo esiphathwayo kuba azifuni uqhagamshelo olungqongqo kwiindawo ezinetrafikhi ephezulu yabahambi ngeenyawo, njengoko zinokugoba ngaphandle kokuqhekeka okanye ukwahlula. Esi sithuba sebhlog siza kuphonononga kwizicelo ezahlukeneyo zePCB eguquguqukayo eqinile kunye noyilo lwePCB olubhetyebhetye.

Ibhodi yeSekethe eprintiweyo (PCB), eyaziwa ngokuba yiBhodi yeSekethe eShicileleyo okanye iBhodi yeSekethe eShicileleyo. Iibhodi eziprintiweyo ezininzi zibhekiselele kwiibhodi eziprintiweyo ezinemigangatho engaphezu kwembini, equlunqwe ngeengcingo ezidibanisayo kwimigangatho emininzi ye-insulating substrates kunye ne-solder pads ezisetyenziselwa ukudibanisa kunye nokuwelda amacandelo e-elektroniki. Abanayo nje umsebenzi wokuqhuba iisekethe zoluhlu ngalunye, kodwa banomsebenzi wokubambisana.

Ibhodi ye-PCB ye-multilayer ibhekisela kwibhodi yesekethe ye-multi-layer esetyenziswa kwiimveliso zombane, esebenzisa iibhodi zocingo ezingaphezulu okanye eziphindwe kabini. Ibhodi yesekethe eprintiweyo esebenzisa umaleko wangaphakathi onamacala amabini, umaleko ongaphandle onamacala amabini, okanye izaleko ezimbini zangaphakathi ezinamacala amabini, kunye nemigangatho emibini engaphandle, kwaye idityaniswe nemizobo eqhubayo ngokweemfuno zoyilo ngokwenkqubo yokubeka kunye nezixhobo zokugquma, iba yibhodi yesekethe eprintiweyo emine okanye emithandathu, eyaziwa ngokuba yibhodi yesekethe eprintiweyo.

Isiseko se-insulation sesinyithi siqulunqwe ngumaleko wesiseko sesinyithi, umaleko wokugquma, kunye nomgangatho wesekethe owenziwe ngobhedu. Yimathiriyeli yebhodi yesekethe yentsimbi eyeyamalungu ngokubanzi e-elektroniki, ebandakanya umaleko wokugquma we-thermal, ipleyiti yesinyithi, kunye nefoyile yentsimbi. Ine-conductivity ekhethekileyo yamagnetic, ukuchithwa kobushushu okugqwesileyo, amandla aphezulu omatshini, kunye nokusebenza kakuhle kokusebenza.

I-metal insulation substrate yenziwe nge-metal substrate layer, i-insulation layer, kunye ne-copper clad circuit layer. Uluhlu oluphezulu ngumaleko wesekethe owenziwe ngobhedu, oqale uqulathe umaleko wobhedu. Ngokweemfuno zokuxhunyelelwa kombane, isiphaluka sinokugqweswa kwisekethe efunekayo. I-core transistor yamandla, i-chip yokulawula umqhubi, njl. Ukuze kube lula ukuwelda kunye nokuthintela i-oxidation, i-solder pad ifakwe i-Ti, i-Pt, i-Cu, i-Au kunye nezinye iifilimu ezincinci zegolide, ezinobukhulu obuyi-35, 50, 70105140 microns; Umaleko ophakathi ngumaleko okhuselayo ophakathi, odla ngokwenziwa ngelaphu le-epoxy yeglasi yefiber encamathelayo eneconductivity entle ye-thermal, i-epoxy resin, okanye ifilimu ye-organic dielectric ezaliswe ngezinto ze-ceramic. Ubukhulu bayo buhlulwe ngokweenkcukacha ezine: 50, 75, 100, 150 microns.

Ibhodi ye-PCB ephezulu ibhekisa kuhlobo olukhethekileyo lwebhodi yesekethe ene-electromagnetic frequency, esetyenziswa kwimimandla yefrikhwensi ephezulu (i-frequency enkulu kuno-300MHz okanye i-wavelength engaphantsi kwe-1 meter) kunye ne-microwave (i-frequency enkulu kune-3GHz okanye ubude be-wavelength ngaphantsi kwe-0.1 yeemitha). Yibhodi yesekethe eveliswe kwi-microwave substrate copper clad board isebenzisa ezinye iinkqubo zokwenza ibhodi yesekethe eqinileyo okanye iindlela ezikhethekileyo zokulungisa.

Icandelo elinzima le-PCB yobhedu yinxalenye ekhulayo yemveliso yethu. Ukuze sixhase eli candelo libalulekileyo, siphuhlisa ubudlelwane bexesha elide kunye neefektri ezininzi ezikhethwe ngononophelo kwinkqubo yethu yokukhangela.