Iintengiso ezishushu

I-PCB sisishunqulelo sebhodi yesekethe eprintiweyo ngesiNgesi. Iisekethe eziprintiweyo zidla ngokubizwa ngokuba ziipateni zokuqhuba ezenziwe ngeesekethe eziprintiweyo, iikhomponenti eziprintiweyo, okanye indibaniselwano yezi zimbini, ngokusekwe kuyilo olumiselwe kwangaphambili kwizinto zokugquma. Ipatheni yokuqhuba enikezela ukudibanisa kombane phakathi kwamacandelo kwi-substrate ekhuselayo ibizwa ngokuba yisekethe eprintiweyo. Ngale ndlela, iisekethe eziprintiweyo okanye iibhodi ezigqityiweyo zeesekethe eziprintiweyo zibizwa ngokuba ziibhodi zeesekethe eziprintiweyo, ezaziwa ngokuba ziibhodi eziprintiweyo okanye iibhodi zeesekethe eziprintiweyo. Kwi-PCB esisiseko, iindawo zigxininiswe kwelinye icala kwaye iingcingo zigxininiswe kwelinye icala. Kuba iingcingo zivela kwicala elinye kuphela, silubiza olu hlobo lwePCB ngokuba yiPCB esecaleni elinye. Ngenxa yokuba ii-PCB ezisecaleni zinemida emininzi engqongqo kuyilo lwesekethe, njengoko zinecala elinye kuphela, i-wiring ayikwazi ukunqumla kwaye kufuneka ihanjiswe ngokuzimeleyo.

I-PCB eguquguqukayo isetyenziswe ngokubanzi kwimarike kwaye ibe yimveliso eyimfuneko kushishino lombane. Iyakwazi ukuziqhelanisa nezicelo ezahlukeneyo zeePCB eziguquguqukayo, ezifana nezixhobo ezinxitywayo, amalungu angengowamvelo, izixhobo zonyango, iimodyuli zeRFID, njl njl. I-PCB eguquguqukayo eqinile ithatha indawo yePCB eqinile, eyenziwe ngezinto zePCB kodwa eneempawu zokugoba. Indibaniselwano ye-PCB eqinile kwaye eguquguqukayo isetyenziselwa iifowuni eziphathwayo kunye neemveliso ezinxitywayo. Zombini ii-PCBs eziguquguqukayo ezithambileyo neziqinileyo zibonelela ngoyilo olomeleleyo kunye nokuguquguquka okongezelelweyo ukuhambisa okanye ukushukuma amacandelo emveliso.

IiPCB eziguquguqukayo ezingqongqo zinokugotshwa, ukugotywa, okanye ukungqukuva, emva koko zidityaniswe kwiimveliso ezahlukeneyo. Babonelela ngokulula, ukuguquguquka, kunye nokuhamba kwezixhobo eziphathwayo. Zibandakanya amakhadi okwandisa kunye neebhetri kwiilaptops okanye kwikhompyuter yedesktop. I-PCB eguquguqukayo ephakathi inokugotywa okanye igobe, kodwa ayiguquguquki njengebhodi eqinile yendibaniselwano ebhetyebhetye. Zikwasisisombululo esisebenzayo sesixhobo esiphathwayo kuba azifuni uqhagamshelo olungqongqo kwiindawo ezinetrafikhi ephezulu yabahambi ngeenyawo, njengoko zinokugoba ngaphandle kokuqhekeka okanye ukwahlula. Esi sithuba sebhlog siza kuphonononga kwizicelo ezahlukeneyo zePCB eguquguqukayo eqinile kunye noyilo lwePCB olubhetyebhetye.

Ibhodi yeSekethe eprintiweyo (PCB), eyaziwa ngokuba yiBhodi yeSekethe eShicileleyo okanye iBhodi yeSekethe eShicileleyo. Iibhodi eziprintiweyo ezininzi zibhekisa kwiibhodi eziprintiweyo ezinamaleko angaphezu kwembini, eziqulunqwe ngeengcingo ezidibanisayo kwiileya ezininzi ze-insulating substrates kunye ne-solder pads ezisetyenziselwa ukudibanisa kunye nokuwelda amacandelo e-elektroniki. Abanayo nje umsebenzi wokuqhuba iisekethe zoluhlu ngalunye, kodwa banomsebenzi wokubambisana.

Ibhodi ye-PCB ye-multilayer ibhekiselele kwibhodi yesekethe ye-multi-layer esetyenziswa kwiimveliso zombane, esebenzisa iibhodi zocingo ezinomnye okanye eziphindwe kabini. Ibhodi yesekethe eprintiweyo esebenzisa umaleko wangaphakathi onamacala amabini, umaleko wangaphandle omacala omabini, okanye izaleko zangaphakathi ezinamacala amabini, kunye nemigangatho emibini engaphandle, kwaye idityaniswe ngemizobo eqhubayo ngokweemfuno zoyilo ngokusebenzisa iinkqubo zokubeka kunye insulating bonding materials, iba umaleko ezine okanye ezintandathu ibhodi yesekethe eprintiweyo, eyaziwa ngokuba multi- umaleko eprintiweyo ibhodi yesekethe.

Isiseko se-insulation sesinyithi siqulunqwe ngumaleko wesiseko sesinyithi, umaleko wokugquma, kunye nomgangatho wesekethe owenziwe ngobhedu. Yimathiriyeli yebhodi yesekethe yentsimbi eyeyamalungu aqhelekileyo e-elektroniki, abandakanya umaleko wokugquma we-thermal, ipleyiti yentsimbi, kunye nefoyile yentsimbi. Ine-conductivity ekhethekileyo yamagnetic, ukuchithwa kobushushu okugqwesileyo, amandla aphezulu omatshini, kunye nokusebenza kakuhle kokusebenza.

I-metal insulation substrate yenziwe nge-metal substrate layer, i-insulation layer, kunye ne-copper clad circuit layer. Uluhlu oluphezulu ngumaleko wesekethe owenziwe ngobhedu, oqale uqulathe umaleko wobhedu. Ngokweemfuno zokuxhunyelelwa kombane, isiphaluka sinokugqweswa kwisekethe efunekayo. I-core transistor yamandla, i-chip yokulawula umqhubi, njl. Ukuze kube lula ukuwelda kunye nokuthintela i-oxidation, i-solder pad ifakwe i-Ti, i-Pt, i-Cu, i-Au kunye nezinye iifilimu ezincinci zegolide, ezinobukhulu obuyi-35, 50, 70105140 microns; Umaleko ophakathi ngumaleko okhuselayo ophakathi, odla ngokwenziwa ngelaphu le-epoxy yeglasi yefiber encamathelayo eneconductivity entle ye-thermal, i-epoxy resin, okanye ifilimu ye-organic dielectric ezaliswe ngezinto ze-ceramic. Ubukhulu bayo buhlulwe ngokweenkcukacha ezine: 50, 75, 100, 150 microns.

Ibhodi ye-PCB ephezulu ibhekisa kuhlobo olukhethekileyo lwebhodi yesekethe enefrikhwensi ye-electromagnetic ephezulu, esetyenziswa kwimimandla yefrikhwensi ephezulu (i-frequency enkulu kuno-300MHz okanye ubude be-wavelength ngaphantsi kwe-1 mitha) kunye ne-microwave (i-frequency enkulu kune-3GHz okanye ubude be-waveleng ngaphantsi kwe-0.1 yeemitha) . Yibhodi yesekethe eveliswe kwi-microwave substrate copper clad board isebenzisa ezinye iinkqubo zokwenza ibhodi yesekethe eqinileyo okanye iindlela ezikhethekileyo zokulungisa.

Icandelo elinzima le-PCB yobhedu yinxalenye ekhulayo yemveliso yethu. Ukuze sixhase eli candelo libalulekileyo, siphuhlisa ubudlelwane bexesha elide kunye neefektri ezininzi ezikhethwe ngononophelo kwinkqubo yethu yokukhangela.

I-HDI PCB (i-High-Density Interconnect PCB) yibhodi yesekethe yoqhagamshelo olunoxinaniso oluphezulu olusetyenziselwa ukuphumeza uqhagamshelo oluninzi kunye noxinaniso oluphezulu kwindawo elinganiselweyo. Ngokuqhelekileyo isetyenziswa kwizixhobo zombane ezintsonkothileyo ezinjengee-smartphones, iitafile kunye neekhompyuter.

Ibhodi yesekethe ye-HDI PCB yamkele uthotho lwetekhnoloji yokuvelisa ephucukileyo, enje ngeesekethe ezincinci, imingxuma engcwatywe iimfama, izichasi ezifakwe ngaphakathi, kunye nonxibelelwano lwe-interlayer. Ezi tekhnoloji zenza ukuba ii-HDI PCBs zifezekise ukuxinana koqhagamshelo oluphezulu kunye noyilo oluntsonkothileyo lwesekethe ngokweesayizi ezincinci.

Ngenxa yenkqubo yokuvelisa kunye neemfuno ezichanekileyo ezichanekileyo zeebhodi zesekethe ze-HDI PCB, iindleko zokwenziwa kwe-HDI PCB zihlala ziphezulu xa kuthelekiswa neebhodi zesekethe eziqhelekileyo. Oku kungenxa yokuba ii-PCB ze-HDI zifuna ukusetyenziswa kweenkqubo ezintsonkothileyo kunye nezixhobo eziphambili ukuphumeza ukuxinana kwazo okuphezulu kunye nobunzima.

Ukongeza, uyilo kunye nokubekwa kweebhodi zesekethe ze-HDI PCB nazo zifuna izixhobo ezininzi zobunjineli kunye nokutyalomali kwexesha lokuqinisekisa ukuthembeka kunye nokusebenza kwesekethe.

Ke ngoko, ngokubanzi, iindleko zokwenziwa kweebhodi zesekethe ze-HDI PCB ziphezulu kuneebhodi zesekethe zemveli. Nangona kunjalo, iindleko ezithile ezichaphazelayo zikwaphenjelelwa zezinye izinto ezininzi, njengenani elifunekayo leeleya, ububanzi bomgca / isithuba, iimfuno zokuvula, njl.

I-FPC (iBhodi yeSekethe eFlexible) luhlobo lwePCB, ekwabizwa ngokuba yi "bhodi ethambileyo". I-FPC yenziwe ngee-substrates eziguquguqukayo ezifana ne-polyimide okanye ifilimu ye-polyester, enenzuzo yokuxinana kwe-wiring ephezulu, ubunzima obulula, ubukhulu obuncinci, ukuguquguquka, kunye nokuguquguquka okuphezulu. Iyakwazi ukumelana nezigidi zokugoba okuguquguqukayo ngaphandle kokonakalisa iingcingo, kwaye ingashukuma kwaye yandise ngokweemfuno zokucwangciswa kwendawo ukufezekisa indibano ye-three-dimensional, ifezekise ukudityaniswa kwendibano yecandelo kunye noqhagamshelo lwengcingo. Ineenzuzo ukuba ezinye iintlobo zeebhodi zeesekethe azikwazi ukuthelekisa.

I-FPC isetyenziswa ngokubanzi kwizixhobo ezibuthathaka zoomatshini kuba ukuguquguquka kwayo kuvumela iibhodi zesekethe ukuba zixhathise ukungcangcazela. IiPCB eziguquguqukayo zomelele ngakumbi kuneebhodi zesekethe zemveli, kodwa inkqubo yazo yokuvelisa inovakalelo kwaye inzima.

Ibhodi yePCB enamacala amabini luhlobo olubaluleke kakhulu lwebhodi yePCB kwimarike yebhodi yesekethe. Kukho iibhodi ze-PCB ezinamacala amabini ezinesiseko sesinyithi, ibhodi yesekethe ye-Hi-Tg enzima yefoyile yobhedu, iibhodi zePCB ezisicaba kwaye ezijijayo ezinamacala amabini, iibhodi zePCB ezijikelezayo, isiseko esixubeneyo sedielectric iibhodi zePCB ezinamacala amabini, njl. ilungele uluhlu olubanzi lwamashishini aphezulu zobugcisa ezifana nonxibelelwano, ukunikezelwa kwamandla, iikhomputha, ulawulo lwamashishini, iimveliso zedijithali, izixhobo zesayensi kunye nezemfundo, izixhobo zonyango, iimoto, ukukhusela i-aerospace, njl.

Abasebenzisi abaninzi beePCBs bafumana iiPCB zeceramic zineadvanteji ngaphezu kweePCB zemveli ezenziwe ngezinye izinto. Olu ncedo kungenxa yokuba ii-PCB ze-ceramic zibonelela ngee-substrates ezifanelekileyo kwiisekethe zombane ezine-conductivity ephezulu ye-thermal kunye ne-coefficient ephantsi yokwandiswa kwe-thermal (CTE).

I-ceramic PCB iguquguquka kakhulu kwaye ingathatha indawo yePCB yesiko epheleleyo ngoyilo oluncinci kunye nokusebenza okwandisiweyo. Unokuzisebenzisa kwiimveliso ezininzi, njengeesekethe ezinamandla aphezulu, iimodyuli ze-chip-on-board kunye nezinzwa ezisondele.