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Multilayer Printed Circuit Boards from China - Top Suppliers & Trusted Factory for High-Quality PCBs

Printed Circuit Boards (PCBs), commonly referred to as multilayer PCBs, are essential components in modern electronic devices. As a leading manufacturer in China, our factory specializes in producing high-quality multilayer printed circuit boards that consist of multiple layers—more than two—of insulating substrates. These layers are interconnected by conductive traces and solder pads, specifically designed for assembling and soldering electronic components. Our multilayer PCBs not only facilitate electrical conductivity across different layers but also provide essential insulation between them.

In the realm of electrical products, multilayer PCBs are crucial for optimizing space and performance. They can consist of configurations such as one double-sided inner layer coupled with two single-sided outer layers or even two double-sided inner layers alongside two single-sided outer layers. These designs are customized to meet specific requirements, utilizing sophisticated positioning systems and insulating bonding materials to create effective four or six-layer printed circuit boards. As a trusted supplier from China, we are committed to delivering reliable and efficient multilayer PCBs tailored to your needs.

    Characteristics of PCB Multilayer Board

    The biggest difference between a multi layer PCB board and a single or double panel is the addition of an internal power layer (maintaining the internal power layer) and a grounding layer. The power and ground network are mainly wired on the power layer. However, multi-layer board wiring is mainly based on the top and bottom layers, supplemented by the middle wiring layer. Therefore, the design method of multi-layer boards is basically the same as that of double-sided boards, and the key lies in how to optimize the wiring of the internal electrical layer to make the wiring of the circuit board more reasonable and have better electromagnetic compatibility.

    Process Flow of PCB Multilayer Board

    Process Flow
    Printed circuit board upper board with completed graphics
    acidic degreasing
    scanning water washing
    secondary countercurrent water washing
    micro etching
    scanning water washing
    secondary countercurrent water washing
    copper plating prepreg
    copper plating
    scanning water washing
    tin plating prepreg
    tin plating
    secondary countercurrent water washing
    lower board

    The difference between a double-sided PCB board and a single-sided PCB board is that the single panel circuit is only on one side of the PCB board, while the circuit of a double-sided PCB board can be connected between the two sides of the PCB board with a through hole in the middle.

    Product Parameters

    Feature AREX´s technical specification
    Number of layers 4 – 22 layers standard, 30 layers advanced, 40 layers prototype.
    Technology highlights Multiple layers of epoxy glass fiber bonded together with multiple layers of copper of varying thicknesses.
    Materials High performance FR4, halogen-free FR4, low loss and low Dk materials
    Copper weights (finished) 18μm – 210μm, advanced 1050μm / 30oz
    Minimum track and gap 0.075mm / 0.075mm
    PCB thickness 0.40mm – 7.0mm
    Maxmimum dimensions 580mm x 1080mm, advanced 610mm x 1400mm
    Surface finishes available HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
    Minimum mechanical drill 0.20mm
    Minimum laser drill 0.10mm standard, 0.075mm advanced

    Frequently Asked Questions (FAQ)

    What is the main difference between a multilayer PCB and a single or double-sided PCB?
    The primary difference is the addition of internal power and grounding layers. The power and ground networks are routed internally, while the top and bottom layers handle the main component wiring, improving overall electromagnetic compatibility.
    How many layers can be manufactured for multilayer PCBs?
    We manufacture 4 to 22 layers as standard technical specifications, up to 30 layers for advanced configurations, and prototypes can support up to 40 layers.
    What surface finishes are available for multilayer boards?
    Available surface finishes include HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic Gold, and Gold Fingers.
    What materials are used in the construction of these boards?
    We utilize high-performance FR4, halogen-free FR4, and specialized low-loss, low-Dk materials to ensure stable electrical characteristics.
    What are the minimum drill sizes for mechanical and laser drilling?
    The minimum mechanical drill size is 0.20mm. For laser drilling, the standard is 0.10mm, with advanced capabilities going down to 0.075mm.