IMS – Insulated Metal Base Printed Circuit Boards

The metal insulation base is composed of a metal base layer, an insulation layer, and a copper clad circuit layer. It is a metal circuit board material that belongs to electronic general components, consisting of a thermal insulation layer, metal plate, and metal foil. It has special magnetic conductivity, excellent heat dissipation, high mechanical strength, and good processing performance.

The metal insulation substrate is composed of a metal substrate layer, an insulation layer, and a copper clad circuit layer. The top layer is a copper clad circuit layer, which initially consists of a layer of copper. According to electrical interconnection requirements, the circuit can be corroded into the required circuit. The power transistor core, driver control chip, etc. can be directly soldered onto the copper clad circuit layer. In order to facilitate welding and prevent oxidation, the solder pad is coated with Ti, Pt, Cu, Au and other gold thin films, with thickness sizes of 35, 50, 70105140 microns; The intermediate layer is an insulating medium layer, usually made of epoxy glass fiber cloth adhesive with good thermal conductivity, epoxy resin, or organic dielectric film filled with ceramic materials. Its thickness is divided into four specifications: 50, 75, 100, 150 microns.