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High-Quality IMS Insulated Metal Base Printed Circuit Boards from China Suppliers and Factory

The metal insulation substrate is an advanced electronic component made up of a metal base layer, an insulating layer, and a copper clad circuit layer. This innovative metal circuit board material, manufactured in China by top suppliers and factories, features exceptional thermal insulation and heat dissipation properties, alongside high mechanical strength and excellent processing capabilities, The structure includes a copper clad circuit layer on top, which starts with a copper layer that can be etched to create precise circuit designs based on electrical interconnection needs. Essential components like power transistors and driver control chips can be directly soldered onto this copper layer. To enhance soldering reliability and prevent oxidation, the solder pads are coated with thin films of materials such as Ti, Pt, Cu, and Au, available in thicknesses of 35, 50, 70, and 140 microns, The insulating medium layer, positioned in the middle, is typically made from epoxy glass fiber cloth adhesive or organic dielectric film enriched with ceramic materials, offering superior thermal conductivity. This layer comes in various thickness options including 50, 75, 100, and 150 microns. Choose our metal insulation substrates from leading suppliers in China for unmatched quality and performance in your electronic applications

    Features

    Special magnetic conductivity

    Excellent heat dissipation capability

    High mechanical strength

    Good processing performance

    Applications

    High-performance floppy disk drives & computer brushless DC motors

    Motors for fully automatic cameras

    Cutting-edge military technology products

    Product Parameters

    Feature AREX´s technical specification
    Number of layers 1 – 4 layers
    Technology highlights Effective heat sink solutions for thermal applications. This construction type enables superior heat dissipation through use of either aluminium or copper substrate bonded to the insulated circuitry through thermal pre-preg or resin systems.
    Materials Aluminium & copper plates. FR-4, PTFE, thermal dielectrics.
    Dielectric thickness 0.05mm – 0.20mm
    Thermal conductivity 1-12 W/m/K
    Profile method Punching, Liquid cooled routing
    Copper weights (finished) 35μm – 140μm
    Minimum track and gaps 0.10mm / 0.10mm
    Metal core thickness 0.40mm – 3.20mm
    Maxmimum dimensions 550mm x 700mm
    Surface finishes available HASL, LF HASL, OSP, ENIG, Imersion tin, Immsersion silver
    Minimum mechanical drill 0.30mm
    Minimum laser drill 0.10mm standard, 0.075mm advanced

    Frequently Asked Questions

    What is an Insulated Metal Base Printed Circuit Board (IMS PCB)?

    An Insulated Metal Base PCB (IMS) is a thermal management board featuring an aluminium or copper substrate base. It is bonded to the circuit layer using a specialized thermal dielectric pre-preg or resin system, allowing for superior heat dissipation compared to traditional FR4 boards.

    What are the thermal conductivity options for AREX IMS PCBs?

    AREX offers highly efficient thermal solutions with a thermal conductivity range of 1 to 12 W/m/K, depending on the dielectric materials and application requirements.

    What materials and layer counts are available for these metal core PCBs?

    We manufacture IMS PCBs with 1 to 4 layers. The primary base materials include high-quality aluminium and copper plates, combined with FR-4, PTFE, and high-performance thermal dielectrics.

    What are the typical applications for IMS PCBs?

    Due to their excellent mechanical strength and heat dissipation, they are widely used in computer brushless DC motors, high-performance floppy disk drives, automatic camera motors, and advanced military technology products.

    What surface finishes and profiling options do you support?

    Available surface finishes include HASL, Lead-Free HASL, OSP, ENIG, Immersion Tin, and Immersion Silver. For profiling, we support both punching and liquid-cooled routing methods.