High Density Interconnect PCB (HDI PCB) - Top China Suppliers & Factory for Advanced Circuit Board Solutions
Product Introduction
HDI PCB is suitable for products with crucial electrical performance and noise suppression. The advantages of HDI PCB include:
HDI technology reduces the overall size of the product and improves electrical performance.
Strong impedance control and impressive high-frequency transmission capability.
Application of HDI PCB Printed Circuit Board
HDI PCB Special Process
Impedance control
Control the impedance value of the conductor on the high-speed PCB within a certain range to meet data transmission requirements.
Back drill
Back drilling is the process of forming through holes by eliminating short cuts in multi-layer printed circuit boards.
The special process of controlling deep drilling is to flow signals from one layer of the board to another.
Through hole in the pad
Via in pad is a process widely used to adapt to high-density interconnect technology. Via in pad belongs to electroplating.
Holes can be simply understood as through holes in BGA pads.
Technical Specifications
| Feature | AREX´s technical specification |
|---|---|
| Number of layers | 4 – 22 layers standard, 30 layers advanced |
| Technology highlights | Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads. |
| HDI builds | 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer / ELIC, Ultra HDI in R&D |
| Materials | FR4 standard, FR4 high performance, Halogen free FR4, Rogers |
| Copper weights (finished) | 18μm – 70μm |
| Minimum track and gap | 0.075mm / 0.075mm |
| PCB thickness | 0.40mm – 3.20mm |
| Maxmimum dimensions | 610mm x 450mm; dependant upon laser drilling machine |
| Surface finishes available | OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers |
| Minimum mechanical drill | 0.15mm |
| Minimum laser drill | 0.10mm standard, 0.075mm advanced |
Frequently Asked Questions (FAQ)
What are the primary advantages of using HDI PCBs?
HDI PCBs reduce the overall size of the product while improving electrical performance. They also offer strong impedance control and impressive high-frequency transmission capabilities.
What are the common applications for HDI Printed Circuit Boards?
They are widely used in battery switches, power distributors, motor controls, LED application controls, automotive, industrial, and communication electronics, as well as satellites and micro systems.
Why is impedance control important in high-speed PCBs?
Impedance control keeps the impedance value of the conductor within a specific range to ensure the board meets high-speed data transmission requirements.
What is the back drilling process in multi-layer PCBs?
Back drilling is a controlled deep drilling process that eliminates short cuts in multi-layer PCBs, allowing signals to flow smoothly from one layer of the board to another.
What is the "via in pad" process and how does it work?
Via in pad is an electroplating process used to adapt to high-density interconnect technology. It essentially places through holes directly inside the BGA pads.
What layer counts and board thicknesses are available for AREX's HDI PCBs?
AREX offers 4 to 22 layers as standard and up to 30 layers for advanced builds, with a board thickness range of 0.40mm to 3.20mm.