Leave Your Message

High-Density Interconnect PCB (HDI PCB) Factory in China - Top Suppliers for Advanced Circuit Boards

HDI PCB (High Density Interconnect PCB) represents a cutting-edge solution for high-density circuit boards designed to maximize connectivity and efficiency within confined spaces. Commonly utilized in intricate electronic devices, including smartphones, tablets, and computers, HDI PCBs are essential for meeting the demands of modern technology.


Manufactured using advanced techniques, HDI PCBs incorporate micro circuits, blind buried holes, embedded resistors, and interlayer interconnections. These innovations facilitate a greater connection density and allow for intricate circuit designs within smaller dimensions, making them a preferred choice for manufacturers in China.


Due to the specialized processes and high precision required for HDI PCB production, the manufacturing costs are generally higher than those of traditional circuit boards. This increase is attributed to the sophisticated technology and equipment employed to achieve the high density and complexity that modern applications demand.


Furthermore, the design and layout of HDI PCBs necessitate a significant investment of engineering resources and time, ensuring the utmost reliability and performance of the circuit. While the overall manufacturing cost tends to be higher than that of conventional boards, several factors, including layer count, line width/spacing, and aperture specifications, also play a crucial role in determining the final price.


As a reliable supplier and factory for HDI PCBs in China, we are committed to delivering high-quality products that meet the evolving needs of the electronics industry. Our expertise and advanced manufacturing capabilities set us apart, ensuring that our customers receive the best solutions for their circuit board requirements.

    Product Introduction

    HDI PCB is suitable for products with crucial electrical performance and noise suppression. The advantages of HDI PCB include:

    HDI technology reduces the overall size of the product and improves electrical performance.
    Strong impedance control and impressive high-frequency transmission capability.

    Application of HDI PCB Printed Circuit Board

    Power & Control Systems
    Battery switch
    Power distributor
    Motor control
    LED application control
    Industries & Advanced Systems
    Automotive, industrial, communication electronics products
    Satellites, micro systems

    HDI PCB Special Process

    Impedance Control

    Control the impedance value of the conductor on the high-speed PCB within a certain range to meet data transmission requirements.

    Back Drill & Via in Pad
    Back Drill

    Back drilling is the process of forming through holes by eliminating short cuts in multi-layer printed circuit boards.

    The special process of controlling deep drilling is to flow signals from one layer of the board to another.

    Through Hole in the Pad

    Via in pad is a process widely used to adapt to high-density interconnect technology. Via in pad belongs to electroplating.

    Holes can be simply understood as through holes in BGA pads.

    HDI PCB High Density Interconnect PCB

    Technical Specifications

    Feature AREX´s technical specification
    Number of layers 4 – 22 layers standard, 30 layers advanced
    Technology highlights Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.
    HDI builds 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer / ELIC, Ultra HDI in R&D
    Materials FR4 standard, FR4 high performance, Halogen free FR4, Rogers
    Copper weights (finished) 18μm – 70μm
    Minimum track and gap 0.075mm / 0.075mm
    PCB thickness 0.40mm – 3.20mm
    Maximum dimensions 610mm x 450mm; dependent upon laser drilling machine
    Surface finishes available OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
    Minimum mechanical drill 0.15mm
    Minimum laser drill 0.10mm standard, 0.075mm advanced

    Frequently Asked Questions (FAQ)

    Q What are the main advantages of using HDI PCBs?
    HDI technology reduces the overall size of the product, improves electrical performance, and provides strong impedance control along with impressive high-frequency transmission capability.
    Q What applications are HDI PCBs suitable for?
    They are ideal for products with critical electrical performance and noise suppression, such as battery switches, power distributors, motor control, LED application control, automotive, industrial, communication electronics, satellites, and micro systems.
    Q What is the purpose of the impedance control process in HDI PCBs?
    Impedance control keeps the impedance value of the conductor on the high-speed PCB within a specific range to satisfy data transmission requirements.
    Q What is back drilling and how does it work?
    Back drilling is a process used to form through holes by removing short cuts in multi-layer printed circuit boards. This special process controls deep drilling to allow signals to flow cleanly from one layer of the board to another.
    Q What is Via in Pad technology?
    Via in pad is an electroplating process widely used to support high-density interconnect technology. It essentially refers to placing through holes directly within the BGA pads.
    Q What are the layer and material capabilities for these HDI PCBs?
    We support 4 to 22 layers standard and up to 30 layers for advanced builds. Available materials include FR4 standard, FR4 high performance, Halogen-free FR4, and Rogers.