High-Density Interconnect PCB (HDI PCB) Factory in China - Top Suppliers for Advanced Circuit Boards
Product Introduction
HDI PCB is suitable for products with crucial electrical performance and noise suppression. The advantages of HDI PCB include:
HDI technology reduces the overall size of the product and improves electrical performance.
Strong impedance control and impressive high-frequency transmission capability.
Application of HDI PCB Printed Circuit Board
Power & Control Systems
Battery switch
Power distributor
Motor control
LED application control
Industries & Advanced Systems
Automotive, industrial, communication electronics products
Satellites, micro systems
HDI PCB Special Process
Impedance Control
Control the impedance value of the conductor on the high-speed PCB within a certain range to meet data transmission requirements.
Back Drill & Via in Pad
Back Drill
Back drilling is the process of forming through holes by eliminating short cuts in multi-layer printed circuit boards.
The special process of controlling deep drilling is to flow signals from one layer of the board to another.
Through Hole in the Pad
Via in pad is a process widely used to adapt to high-density interconnect technology. Via in pad belongs to electroplating.
Holes can be simply understood as through holes in BGA pads.
Technical Specifications
| Feature | AREX´s technical specification |
| Number of layers | 4 – 22 layers standard, 30 layers advanced |
| Technology highlights | Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads. |
| HDI builds | 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer / ELIC, Ultra HDI in R&D |
| Materials | FR4 standard, FR4 high performance, Halogen free FR4, Rogers |
| Copper weights (finished) | 18μm – 70μm |
| Minimum track and gap | 0.075mm / 0.075mm |
| PCB thickness | 0.40mm – 3.20mm |
| Maximum dimensions | 610mm x 450mm; dependent upon laser drilling machine |
| Surface finishes available | OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers |
| Minimum mechanical drill | 0.15mm |
| Minimum laser drill | 0.10mm standard, 0.075mm advanced |
Frequently Asked Questions (FAQ)
Q
What are the main advantages of using HDI PCBs?
HDI technology reduces the overall size of the product, improves electrical performance, and provides strong impedance control along with impressive high-frequency transmission capability.
Q
What applications are HDI PCBs suitable for?
They are ideal for products with critical electrical performance and noise suppression, such as battery switches, power distributors, motor control, LED application control, automotive, industrial, communication electronics, satellites, and micro systems.
Q
What is the purpose of the impedance control process in HDI PCBs?
Impedance control keeps the impedance value of the conductor on the high-speed PCB within a specific range to satisfy data transmission requirements.
Q
What is back drilling and how does it work?
Back drilling is a process used to form through holes by removing short cuts in multi-layer printed circuit boards. This special process controls deep drilling to allow signals to flow cleanly from one layer of the board to another.
Q
What is Via in Pad technology?
Via in pad is an electroplating process widely used to support high-density interconnect technology. It essentially refers to placing through holes directly within the BGA pads.
Q
What are the layer and material capabilities for these HDI PCBs?
We support 4 to 22 layers standard and up to 30 layers for advanced builds. Available materials include FR4 standard, FR4 high performance, Halogen-free FR4, and Rogers.


