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High Density Interconnect PCB (HDI PCB) - China Suppliers & Factory for Advanced Circuit Board Solutions

HDI PCB (High Density Interconnect PCB) is an advanced circuit board designed to maximize connectivity and density within limited space. Commonly utilized in complex electronic devices like smartphones, tablets, and computers, HDI PCBs are a popular choice among manufacturers in China.


These circuit boards leverage cutting-edge manufacturing technologies, including micro circuits, blind buried holes, embedded resistors, and interlayer interconnections. By employing these techniques, HDI PCBs can achieve superior connection density and intricate circuit designs in compact formats, making them essential for modern electronics.


Due to the sophisticated manufacturing processes and high precision demands, the production cost of HDI PCBs tends to be higher compared to traditional circuit boards. The need for advanced equipment and elaborate procedures to attain their complexity contributes to this increased cost. As a leading factory in the industry, we are committed to delivering top-quality HDI PCBs to our clients.


Moreover, designing and laying out HDI PCB circuits require significant engineering resources and time to ensure optimal reliability and performance. Consequently, while the manufacturing costs are generally elevated, they are influenced by factors such as the number of layers, line width/spacing, and aperture specifications. As reliable suppliers, we offer competitive pricing without compromising on quality, ensuring your HDI PCB needs are met efficiently.

    Product Introduction

    HDI PCB is suitable for products with crucial electrical performance and noise suppression. The advantages of HDI PCB include:

    • HDI technology reduces the overall size of the product and improves electrical performance.
    • Strong impedance control and impressive high-frequency transmission capability.

    Application of HDI PCB Printed Circuit Board

    Power & Control
    • Battery switch
    • Power distributor
    • Motor control
    • LED application control
    Advanced Systems
    • Automotive, industrial, communication electronics products
    • Satellites, micro systems

    HDI PCB Special Process

    Impedance Control

    Control the impedance value of the conductor on the high-speed PCB within a certain range to meet data transmission requirements.

    Back Drill

    Back drilling is the process of forming through holes by eliminating short cuts in multi-layer printed circuit boards.

    The special process of controlling deep drilling is to flow signals from one layer of the board to another.

    Through Hole in the Pad

    Via in pad is a process widely used to adapt to high-density interconnect technology. Via in pad belongs to electroplating.

    Holes can be simply understood as through holes in BGA pads.

    HDI PCB High Density Interconnect PCB

    Technical Specifications

    Feature AREX´s technical specification
    Number of layers 4 – 22 layers standard, 30 layers advanced
    Technology highlights Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.
    HDI builds 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer / ELIC, Ultra HDI in R&D
    Materials FR4 standard, FR4 high performance, Halogen free FR4, Rogers
    Copper weights (finished) 18μm – 70μm
    Minimum track and gap 0.075mm / 0.075mm
    PCB thickness 0.40mm – 3.20mm
    Maximum dimensions 610mm x 450mm; dependant upon laser drilling machine
    Surface finishes available OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
    Minimum mechanical drill 0.15mm
    Minimum laser drill 0.10mm standard, 0.075mm advanced

    Frequently Asked Questions

    What are the main advantages of using HDI PCBs?
    HDI PCBs reduce the overall size of the product, enhance electrical performance, provide strong impedance control, and offer high-frequency transmission capability.
    What applications benefit most from HDI PCB technology?
    HDI PCBs are widely used in battery switches, power distributors, motor controls, LED control systems, automotive electronics, satellites, and micro systems.
    What is the purpose of impedance control in HDI PCBs?
    Impedance control keeps the electrical impedance value of the conductor within a strict range on high-speed PCBs to meet precise data transmission requirements.
    How does the back drilling process work?
    Back drilling is a deep-controlled drilling process that eliminates unused portions of through holes (stubs) in multi-layer PCBs, allowing signals to flow cleanly between target layers.
    What is "Via in Pad" technology in HDI PCBs?
    Via in pad is an electroplating process where through-holes are placed directly within BGA pads to maximize connection density.
    What layer counts and materials are available for these HDI PCBs?
    They support 4 to 22 standard layers (up to 30 advanced layers) and use materials such as standard FR4, high-performance FR4, Halogen-free FR4, and Rogers.