High Density Interconnect PCB (HDI PCB) - China Suppliers & Factory for Advanced Circuit Board Solutions
Product Introduction
HDI PCB is suitable for products with crucial electrical performance and noise suppression. The advantages of HDI PCB include:
- HDI technology reduces the overall size of the product and improves electrical performance.
- Strong impedance control and impressive high-frequency transmission capability.
Application of HDI PCB Printed Circuit Board
Power & Control
- Battery switch
- Power distributor
- Motor control
- LED application control
Advanced Systems
- Automotive, industrial, communication electronics products
- Satellites, micro systems
HDI PCB Special Process
Impedance Control
Control the impedance value of the conductor on the high-speed PCB within a certain range to meet data transmission requirements.
Back Drill
Back drilling is the process of forming through holes by eliminating short cuts in multi-layer printed circuit boards.
The special process of controlling deep drilling is to flow signals from one layer of the board to another.
Through Hole in the Pad
Via in pad is a process widely used to adapt to high-density interconnect technology. Via in pad belongs to electroplating.
Holes can be simply understood as through holes in BGA pads.
Technical Specifications
| Feature | AREX´s technical specification |
| Number of layers | 4 – 22 layers standard, 30 layers advanced |
| Technology highlights | Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads. |
| HDI builds | 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer / ELIC, Ultra HDI in R&D |
| Materials | FR4 standard, FR4 high performance, Halogen free FR4, Rogers |
| Copper weights (finished) | 18μm – 70μm |
| Minimum track and gap | 0.075mm / 0.075mm |
| PCB thickness | 0.40mm – 3.20mm |
| Maximum dimensions | 610mm x 450mm; dependant upon laser drilling machine |
| Surface finishes available | OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers |
| Minimum mechanical drill | 0.15mm |
| Minimum laser drill | 0.10mm standard, 0.075mm advanced |
Frequently Asked Questions
What are the main advantages of using HDI PCBs?
HDI PCBs reduce the overall size of the product, enhance electrical performance, provide strong impedance control, and offer high-frequency transmission capability.
What applications benefit most from HDI PCB technology?
HDI PCBs are widely used in battery switches, power distributors, motor controls, LED control systems, automotive electronics, satellites, and micro systems.
What is the purpose of impedance control in HDI PCBs?
Impedance control keeps the electrical impedance value of the conductor within a strict range on high-speed PCBs to meet precise data transmission requirements.
How does the back drilling process work?
Back drilling is a deep-controlled drilling process that eliminates unused portions of through holes (stubs) in multi-layer PCBs, allowing signals to flow cleanly between target layers.
What is "Via in Pad" technology in HDI PCBs?
Via in pad is an electroplating process where through-holes are placed directly within BGA pads to maximize connection density.
What layer counts and materials are available for these HDI PCBs?
They support 4 to 22 standard layers (up to 30 advanced layers) and use materials such as standard FR4, high-performance FR4, Halogen-free FR4, and Rogers.


