High-Density Interconnect PCB (HDI PCB) - China Suppliers & Factory for Advanced Circuit Board Solutions
Product Introduction
HDI PCB is suitable for products with crucial electrical performance and noise suppression. The advantages of HDI PCB include:
HDI technology reduces the overall size of the product and improves electrical performance.
Strong impedance control and impressive high-frequency transmission capability.
Application of HDI PCB Printed Circuit Board
Battery switch
Power distributor
Motor control
LED application control
Automotive, industrial, communication electronics products
Satellites, micro systems
HDI PCB Special Process
Impedance Control
Control the impedance value of the conductor on the high-speed PCB within a certain range to meet data transmission requirements.
Back Drill & Via in Pad
Back Drill
Back drilling is the process of forming through holes by eliminating short cuts in multi-layer printed circuit boards. The special process of controlling deep drilling is to flow signals from one layer of the board to another.
Through Hole in the Pad (Via in Pad)
Via in pad is a process widely used to adapt to high-density interconnect technology. Via in pad belongs to electroplating. Holes can be simply understood as through holes in BGA pads.
| Feature | AREX´s technical specification |
| Number of layers | 4 – 22 layers standard, 30 layers advanced |
| Technology highlights | Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads. |
| HDI builds | 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer / ELIC, Ultra HDI in R&D |
| Materials | FR4 standard, FR4 high performance, Halogen free FR4, Rogers |
| Copper weights (finished) | 18μm – 70μm |
| Minimum track and gap | 0.075mm / 0.075mm |
| PCB thickness | 0.40mm – 3.20mm |
| Maxmimum dimensions | 610mm x 450mm; dependant upon laser drilling machine |
| Surface finishes available | OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers |
| Minimum mechanical drill | 0.15mm |
| Minimum laser drill | 0.10mm standard, 0.075mm advanced |
Frequently Asked Questions
What is an HDI PCB?
HDI (High Density Interconnect) PCB is a circuit board with a higher wiring density per unit area than conventional boards. It utilizes microvias, blind/buried vias, and finer lines to achieve a compact design and enhanced electrical performance.
What are the main benefits of using HDI PCBs?
HDI technology significantly reduces the overall size and weight of final products while improving electrical performance. It also offers excellent impedance control and strong high-frequency transmission capabilities.
What is the purpose of back drilling in HDI PCB manufacturing?
Back drilling is a specialized process that removes unused portions (stubs) of copper plated through-holes. This helps prevent signal reflections and improves signal integrity as signals flow from one layer of the board to another.
What is a "Via in Pad" process?
Via in Pad is a design technique where the through-hole (via) is placed directly within the surface mount pad of a component (such as BGA pads). It is widely used to support high-density interconnect requirements and optimize space.
What materials are typically used for HDI PCBs?
Standard HDI builds utilize materials like standard FR4, high-performance FR4, Halogen-free FR4, and specialized high-frequency materials such as Rogers to ensure optimal thermal and electrical properties.