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High Density Interconnect (HDI) PCBs from China Suppliers and Factory - Advanced Circuit Board Solutions

HDI PCB (High Density Interconnect PCB) is an advanced circuit board solution designed for high-density interconnections in compact spaces. Used extensively in complex electronic devices such as smartphones, tablets, and computers, HDI PCBs enable manufacturers to achieve more connections within a limited footprint.


Manufactured using cutting-edge technologies like microcircuits, blind and buried vias, embedded resistors, and interlayer interconnections, HDI PCBs deliver unmatched connection density and sophisticated circuit designs. As one of the leading suppliers from China, our factory specializes in producing high-quality HDI PCBs tailored to meet the specific requirements of our customers.


While the advanced manufacturing processes and precision requirements contribute to a higher production cost compared to traditional circuit boards, the benefits of HDI technology justify the investment. Our factory employs state-of-the-art equipment to achieve high density and complexity in our PCB designs.


Moreover, the design and layout of HDI PCBs necessitate significant engineering resources and time to ensure reliability and optimal performance. Consequently, the overall manufacturing cost is generally higher than that of standard circuit boards, influenced by various factors such as layer count, line width/spacing, and aperture specifications. Choose our China-based factory for your HDI PCB needs and experience superior quality and service tailored for your electronic applications.

    Product Introduction

    HDI PCB is suitable for products with crucial electrical performance and noise suppression. The advantages of HDI PCB include:

    • HDI technology reduces the overall size of the product and improves electrical performance.
    • Strong impedance control and impressive high-frequency transmission capability.

    Application of HDI PCB Printed Circuit Board

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    ● Battery switch

    ● Power distributor

    ● Motor control

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    LED application control

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    ● Automotive, industrial, communication electronics products

    ● Satellites, micro systems

    HDI PCB Special Process

    Impedance Control

    Control the impedance value of the conductor on the high-speed PCB within a certain range to meet data transmission requirements.

    Back Drill

    Back drilling is the process of forming through holes by eliminating short cuts in multi-layer printed circuit boards. The special process of controlling deep drilling is to flow signals from one layer of the board to another.

    Through Hole in the Pad

    Via in pad is a process widely used to adapt to high-density interconnect technology. Via in pad belongs to electroplating. Holes can be simply understood as through holes in BGA pads.

    HDI PCB High Density Interconnect PCB

    Technical Specifications

    Feature AREX´s technical specification
    Number of layers 4 – 22 layers standard, 30 layers advanced
    Technology highlights Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.
    HDI builds 1+N+1, 2+N+2, 3+N+3, 4+N+4, any layer / ELIC, Ultra HDI in R&D
    Materials FR4 standard, FR4 high performance, Halogen free FR4, Rogers
    Copper weights (finished) 18μm – 70μm
    Minimum track and gap 0.075mm / 0.075mm
    PCB thickness 0.40mm – 3.20mm
    Maximum dimensions 610mm x 450mm; dependant upon laser drilling machine
    Surface finishes available OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
    Minimum mechanical drill 0.15mm
    Minimum laser drill 0.10mm standard, 0.075mm advanced

    Frequently Asked Questions (FAQ)

    Q1: What are the primary benefits of using HDI PCB technology?

    HDI technology significantly reduces the overall size of the product while simultaneously improving electrical performance. It offers strong impedance control and superior high-frequency transmission capabilities.

    Q2: What industries commonly utilize HDI Printed Circuit Boards?

    HDI PCBs are widely used in automotive electronics, industrial controls, communication products, satellites, micro systems, and power distribution units like battery switches.

    Q3: How many layers can AREX produce for HDI PCBs?

    We offer a standard range of 4 to 22 layers, with advanced capabilities reaching up to 30 layers for complex high-density requirements.

    Q4: What is the "Via in Pad" process in HDI manufacturing?

    Via in Pad is a technology used to adapt to high-density interconnects where through holes are placed directly in the BGA pads and electroplated, allowing for more efficient space utilization.

    Q5: What is the purpose of the Back Drill process?

    Back drilling is used to eliminate stubs in multi-layer boards by removing unnecessary portions of through holes, which helps in controlling signal flow between specific layers and reducing signal interference.

    Q6: What materials are available for HDI PCB production?

    We support a variety of materials including standard FR4, high-performance FR4, Halogen-free FR4, and specialized Rogers materials for high-frequency applications.