High Density Interconnect (HDI) PCBs from China Suppliers and Factory - Advanced Circuit Board Solutions
Product Introduction
HDI PCB is suitable for products with crucial electrical performance and noise suppression. The advantages of HDI PCB include:
- HDI technology reduces the overall size of the product and improves electrical performance.
- Strong impedance control and impressive high-frequency transmission capability.
Application of HDI PCB Printed Circuit Board
● Battery switch
● Power distributor
● Motor control
LED application control
● Automotive, industrial, communication electronics products
● Satellites, micro systems
HDI PCB Special Process
Impedance Control
Control the impedance value of the conductor on the high-speed PCB within a certain range to meet data transmission requirements.
Back Drill
Back drilling is the process of forming through holes by eliminating short cuts in multi-layer printed circuit boards. The special process of controlling deep drilling is to flow signals from one layer of the board to another.
Through Hole in the Pad
Via in pad is a process widely used to adapt to high-density interconnect technology. Via in pad belongs to electroplating. Holes can be simply understood as through holes in BGA pads.
Technical Specifications
| Feature | AREX´s technical specification |
| Number of layers | 4 – 22 layers standard, 30 layers advanced |
| Technology highlights | Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads. |
| HDI builds | 1+N+1, 2+N+2, 3+N+3, 4+N+4, any layer / ELIC, Ultra HDI in R&D |
| Materials | FR4 standard, FR4 high performance, Halogen free FR4, Rogers |
| Copper weights (finished) | 18μm – 70μm |
| Minimum track and gap | 0.075mm / 0.075mm |
| PCB thickness | 0.40mm – 3.20mm |
| Maximum dimensions | 610mm x 450mm; dependant upon laser drilling machine |
| Surface finishes available | OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers |
| Minimum mechanical drill | 0.15mm |
| Minimum laser drill | 0.10mm standard, 0.075mm advanced |
Frequently Asked Questions (FAQ)
HDI technology significantly reduces the overall size of the product while simultaneously improving electrical performance. It offers strong impedance control and superior high-frequency transmission capabilities.
HDI PCBs are widely used in automotive electronics, industrial controls, communication products, satellites, micro systems, and power distribution units like battery switches.
We offer a standard range of 4 to 22 layers, with advanced capabilities reaching up to 30 layers for complex high-density requirements.
Via in Pad is a technology used to adapt to high-density interconnects where through holes are placed directly in the BGA pads and electroplated, allowing for more efficient space utilization.
Back drilling is used to eliminate stubs in multi-layer boards by removing unnecessary portions of through holes, which helps in controlling signal flow between specific layers and reducing signal interference.
We support a variety of materials including standard FR4, high-performance FR4, Halogen-free FR4, and specialized Rogers materials for high-frequency applications.


