HDI PCB High Density Interconnect PCB

HDI PCB (High Density Interconnect PCB) is a high-density interconnect circuit board used to achieve more connections and higher density in limited space. It is typically used in complex electronic devices such as smartphones, tablets, and computers.

The HDI PCB circuit board adopts a series of advanced manufacturing technologies, such as micro circuits, blind buried holes, embedded resistors, and interlayer interconnections. These technologies enable HDI PCBs to achieve higher connection density and more complex circuit designs in relatively small sizes.

Due to the manufacturing process and high precision requirements of HDI PCB circuit boards, the manufacturing cost of HDI PCB is usually higher compared to traditional ordinary circuit boards. This is because HDI PCBs require the use of more complex processes and advanced equipment to achieve their high density and complexity.

In addition, the design and layout of HDI PCB circuit boards also require more engineer resources and time investment to ensure the reliability and performance of the circuit.

Therefore, in general, the manufacturing cost of HDI PCB circuit boards is higher than that of traditional circuit boards. However, the specific cost influencing factors are also influenced by many other factors, such as the required number of layers, line width/spacing, aperture requirements, etc.