Kūʻai wela

ʻO PCB ka pōkole no ka papa kaapuni paʻi ma ka ʻōlelo Pelekania. ʻO nā kaapuni i paʻi ʻia i kapa ʻia ʻo ia nā ʻano conductive i hana ʻia me nā kaapuni i paʻi ʻia, nā ʻāpana i paʻi ʻia, a i ʻole ka hui ʻana o nā mea ʻelua, e pili ana i nā hoʻolālā i koho mua ʻia ma nā mea insulating. ʻO ke ʻano conductive e hāʻawi ana i nā pilina uila ma waena o nā ʻāpana ma kahi substrate insulating i kapa ʻia he kaapuni paʻi. Ma kēia ʻano, ua kapa ʻia nā papa kaapuni paʻi a i ʻole nā ​​papa i hoʻopau ʻia o nā papa kaapuni paʻi ʻia, ʻike ʻia hoʻi nā papa paʻi a i ʻole nā ​​​​papa kaapuni paʻi. Ma ka PCB maʻamau, hoʻopaʻa ʻia nā ʻāpana ma kekahi ʻaoʻao a hoʻopaʻa ʻia nā uea ma kēlā ʻaoʻao. No ka mea, ʻike ʻia nā uea ma kahi ʻaoʻao, kapa mākou i kēia ʻano PCB he PCB ʻaoʻao hoʻokahi. No ka mea he nui nā palena koʻikoʻi o nā PCB ʻaoʻao hoʻokahi i ka hoʻolālā kaapuni, no ka mea he ʻaoʻao hoʻokahi wale nō lākou, ʻaʻole hiki ke hoʻokuʻi ʻia ka uwea a pono e holo kaʻawale.

Ua hoʻohana nui ʻia ka PCB maʻalahi i ka mākeke a ua lilo ia i mea waiwai nui i ka ʻoihana uila. Hiki iā ia ke hoʻololi i nā noi like ʻole o nā PCB hiki ke hoʻololi ʻia, e like me nā mea hiki ke hoʻohana ʻia, nā ʻāpana hana, nā mea lapaʻau, nā modula RFID, a me nā mea ʻē aʻe. Hoʻohana nui ʻia ka hui pū ʻana o ka PCB paʻa a me ka maʻalahi no nā kelepona kelepona a me nā huahana hiki ke hoʻohana. Hāʻawi nā PCB hikiwawe a paʻa ʻelua i nā hoʻolālā paʻa me ka maʻalahi hou e neʻe a lulu i nā ʻāpana huahana.

Hiki i nā PCB hiki ke hoʻopaʻa ʻia, hoʻopiʻi ʻia, a puni, a laila hoʻohui ʻia i loko o nā huahana like ʻole. Hāʻawi lākou i ka maʻalahi, ka maʻalahi, a me ka neʻe ʻana no nā polokalamu kelepona. Loaʻa iā lākou nā kāleka hoʻonui a me nā pihi ma nā kamepiula kamepiula a i ʻole kamepiula papapihi. Hiki ke piʻo a piʻo paha ka PCB semi-flexible, akā ʻaʻole ia e like me ka maʻalahi e like me ka papa hoʻohui paʻa paʻa. He ʻoluʻolu hāmeʻa kūpono hoʻi lākou no ka mea ʻaʻole lākou e koi i nā pilina paʻa i nā wahi me nā kaʻa hele wāwae kiʻekiʻe, no ka mea hiki iā lākou ke kūlou me ka ʻole o ka haki ʻana a me ka hoʻokaʻawale ʻana. E komo kēia pou blog i nā noi like ʻole o ka PCB hikiwawe a me ka hoʻolālā PCB semi-flexible.

Papa Kaapuni Pai (PCB), i kapa ʻia ʻo Papa Kaapuni Pai a i ʻole Papa Kaapuni Pai. ʻO nā papa paʻi multilayer e pili ana i nā papa i paʻi ʻia me ka ʻoi aku o ʻelua papa, i haku ʻia me nā uwea hoʻohui ʻana ma kekahi mau papa o nā substrate insulating a me nā pad solder i hoʻohana ʻia no ka hui ʻana a me ka wiliwili ʻana i nā mea uila. ʻAʻole wale lākou i ka hana o ke alakaʻi ʻana i nā kaapuni o kēlā me kēia papa, akā loaʻa pū kekahi i ka hana o ka insulation like.

ʻO ka PCB multilayer board e pili ana i kahi papa kaapuni multi-layer i hoʻohana ʻia i nā huahana uila, e hoʻohana ana i nā papa uwila hoʻokahi a ʻelua ʻaoʻao. He papa kaapuni paʻi e hoʻohana ana i hoʻokahi papa ʻaoʻao ʻelua ʻaoʻao i loko, ʻelua ʻaoʻao hoʻokahi ʻaoʻao waho, a i ʻole ʻelua ʻaoʻao ʻelua ʻaoʻao i loko, a ʻelua ʻaoʻao ʻaoʻao waho ʻelua, a pili pū me nā kiʻi conductive e like me nā koi hoʻolālā ma o nā ʻōnaehana hoʻonohonoho a ʻO nā mea hoʻopaʻa hoʻopaʻa insulating, lilo i ʻehā a ʻeono ʻāpana paʻi kaapuni, ʻike ʻia hoʻi he papa kaapuni paʻi nui.

Hoʻokumu ʻia ke kumu hoʻoheheʻe metala me kahi papa kumu metala, kahi ʻāpana hoʻokaʻawale, a me kahi ʻāpana kaapuni keleawe. He mea metala papa kaapuni ia e pili ana i nā ʻāpana maʻamau uila, i loaʻa i kahi ʻāpana hoʻokaʻawale wela, ka pā metala, a me ka foil metala. Loaʻa iā ia ka conductivity magnetic kūikawā, ka hoʻoheheʻe wela maikaʻi loa, ka ikaika mechanical kiʻekiʻe, a me ka hana hana maikaʻi.

Hoʻokumu ʻia ka ʻāpana hoʻoheheʻe metala me kahi papa hoʻoheheʻe metala, kahi ʻāpana insulation, a me kahi papa kaapuni keleawe. ʻO ka papa luna he ʻāpana kaapuni keleawe, kahi i hoʻomaka mua ʻia me kahi papa keleawe. E like me nā koi pili uila, hiki ke hoʻopili ʻia ke kaapuni i ke kaapuni i makemake ʻia. Hiki ke kūʻai pololei ʻia ka mana transistor core, ka pahu hoʻokele hoʻokele, a me nā mea ʻē aʻe ma luna o ka papa kaapuni keleawe. I mea e maʻalahi ai ka wiliwili ʻana a me ka pale ʻana i ka oxidation, ua uhi ʻia ka solder pad me Ti, Pt, Cu, Au a me nā kiʻi ʻoniʻoni gula ʻē aʻe, me ka nui o ka mānoanoa o 35, 50, 70105140 microns; ʻO ka papa waena he insulating medium layer, maʻamau i hana ʻia me ka epoxy glass fiber cloth adhesive me ka conductivity thermal maikaʻi, epoxy resin, a i ʻole ke kiʻiʻoniʻoni dielectric organik piha i nā mea seramika. Ua māhele ʻia kona mānoanoa i ʻehā mau kikoʻī: 50, 75, 100, 150 microns.

ʻO ka papa PCB kiʻekiʻe kiʻekiʻe e pili ana i kahi ʻano kūikawā o ka papa kaapuni me ke alapine electromagnetic kiʻekiʻe, i hoʻohana ʻia ma nā kahua o ke alapine kiʻekiʻe (frequency ʻoi aku ma mua o 300MHz a i ʻole ka lōʻihi hawewe ma lalo o 1 mika) a me ka microwave (frequency ʻoi aku ma mua o 3GHz a i ʻole ka lōʻihi hawewe ma lalo o 0.1 mika) . He papa kaapuni ia i hana ʻia ma luna o ka microwave substrate copper clad board me ka hoʻohana ʻana i kekahi mau kaʻina o ka hana ʻana o ka papa kaapuni paʻa maʻamau a i ʻole nā ​​​​ʻano hana hana kūikawā.

ʻO ka māhele PCB keleawe kaumaha kahi ʻāpana ulu o kā mākou hana. I mea e kākoʻo ai i kēia māhele koʻikoʻi, ke kūkulu nei mākou i nā pilina lōʻihi me nā hale hana i koho pono ʻia i kā mākou kaʻina hana.

ʻO HDI PCB (High Density Interconnect PCB) kahi papa kaapuni pili kiʻekiʻe kiʻekiʻe i hoʻohana ʻia no ka loaʻa ʻana o nā pilina hou aʻe a me ke kiʻekiʻe kiʻekiʻe i ka palena palena. Hoʻohana maʻamau ia i nā mea uila paʻakikī e like me nā smartphones, papa, a me nā kamepiula.

Hoʻohana ka HDI PCB circuit board i nā ʻenehana hana kiʻekiʻe, e like me nā micro circuits, nā puka kanu makapō, nā mea pale i hoʻopili ʻia, a me nā interlayer interconnections. Hāʻawi kēia mau ʻenehana i nā HDI PCB e hoʻokō i ka nui o ka pilina pili kiʻekiʻe a me nā hoʻolālā kaapuni paʻakikī i nā liʻiliʻi liʻiliʻi.

Ma muli o ke kaʻina hana a me nā koi kikoʻī kiʻekiʻe o nā papa kaapuni HDI PCB, ʻoi aku ka kiʻekiʻe o ke kumukūʻai hana o HDI PCB i hoʻohālikelike ʻia i nā papa kaapuni maʻamau. ʻO kēia no ka mea e koi ana nā HDI PCB i ka hoʻohana ʻana i nā kaʻina hana paʻakikī a me nā mea hana kiʻekiʻe e hoʻokō i kā lākou kiʻekiʻe kiʻekiʻe a paʻakikī.

Eia kekahi, ʻo ka hoʻolālā a me ka hoʻolālā ʻana o nā papa kaapuni HDI PCB e koi hou aku i nā kumuwaiwai ʻenekinia a me ka hoʻolimalima manawa e hōʻoia i ka hilinaʻi a me ka hana o ke kaapuni.

No laila, ma ka laulā, ʻoi aku ka kiʻekiʻe o ke kumukūʻai hana o nā papa kaapuni HDI PCB ma mua o nā papa kaapuni kuʻuna. Eia nō naʻe, ua hoʻopili ʻia nā kumu kūʻai kikoʻī e pili ana i nā kumu ʻē aʻe, e like me ka helu o nā papa, ka laulā laina / spacing, nā koi aperture, etc.

ʻO FPC (Flexible Circuit Board) kahi ʻano PCB, ʻike ʻia hoʻi he "papa palupalu". Hana ʻia ʻo FPC i nā substrate maʻalahi e like me ka polyimide a i ʻole ka polyester film, nona nā mea maikaʻi o ke kiʻekiʻe uea kiʻekiʻe, ke kaumaha māmā, ka mānoanoa lahilahi, ka maʻalahi, a me ka hiki ke kiʻekiʻe. Hiki iā ia ke pale i nā miliona o nā wili ikaika me ka ʻole o ka hōʻino ʻana i nā uea, a hiki ke neʻe a hoʻonui e like me nā koi hoʻolālā spatial e hoʻokō i ka hui ʻekolu-dimensional, e hoʻokō i ka hoʻohui ʻana o ka hui ʻāpana a me ka pilina uea. Loaʻa iā ia nā pōmaikaʻi ʻaʻole hiki ke hoʻohālikelike ʻia nā ʻano papa kaapuni ʻē aʻe.

Hoʻohana nui ʻia ʻo FPC i nā mea hana ʻenehana no ka mea hiki i kona maʻalahi ke hiki i nā papa kaapuni ke pale i ka haʻalulu. ʻOi aku ka lōʻihi o nā PCB maʻalahi ma mua o nā papa kaapuni kahiko, akā paʻakikī a paʻakikī kā lākou hana hana.

ʻO ka papa PCB ʻaoʻao ʻelua he ʻano koʻikoʻi o ka papa PCB ma ka mākeke papa kaapuni. Aia i papalua-ʻaoʻao PCB papa me ka metala kumu, Hi-Tg kaumaha keleawe foil kaapuni papa, palahalaha a me ka wili lua-ʻaoʻao PCB papa, kiʻekiʻe-frequency PCB papa, hui dielectric kumu kiʻekiʻe-alapine papalua-aoao PCB papa, etc. kūpono no ka laulā o nā ʻoihana ʻenehana kiʻekiʻe e like me ke kelepona, ka lako mana, nā kamepiula, ka mana ʻoihana, nā huahana kikohoʻe, nā mea ʻepekema a me ka hoʻonaʻauao, nā mea lapaʻau, nā kaʻa, ka pale aerospace, etc.

Nui nā mea hoʻohana o nā PCB e ʻike i nā PCB seramika i ʻoi aku ka maikaʻi ma mua o nā PCB kuʻuna i hana ʻia me nā mea ʻē aʻe. ʻO kēia pōmaikaʻi no ka mea hāʻawi nā PCB ceramic i nā substrate kūpono no nā kaʻa uila me ka conductivity thermal kiʻekiʻe a me ka coefficient haʻahaʻa o ka hoʻonui wela (CTE).

He maʻalahi loa ka PCB ceramic a hiki ke hoʻololi i kahi PCB kuʻuna piha me kahi hoʻolālā liʻiliʻi liʻiliʻi a hoʻonui i ka hana. Hiki iā ʻoe ke hoʻohana iā lākou i nā huahana he nui, e like me nā kaapuni mana kiʻekiʻe, nā modula chip-on-board a me nā mea ʻike pili.