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Double Sided Printed Circuit Boards
Process Editing
Double-sided printed boards are usually made of epoxy glass cloth copper foil. It is mainly used for communication electronics with high performance requirements Equipment, advanced instruments and electronic computers, etc.
The production process of double-sided boards is generally divided into several methods, including process wire method, hole blocking method, masking method, and graphic electroplating etching method.
Sampling
The most commonly used method for double-sided PCB sampling is the process. At the same time, rosin process, OSP process, gold plating process, gold deposition, and silver plating processes are also applicable in double-sided boards.
Tin spraying process: Good appearance, silver white solder pad, easy to solder, easy to solder, and low price.
Tin metal process: Stable quality, usually used in the presence of bonding ICs.
Distinguishing content
The difference between a double-sided PCB board and a single-sided PCB board is that the single panel circuit is only on one side of the PCB board, while the circuit of a double-sided PCB board can be connected between the two sides of the PCB board with a through hole in the middle.
The parameters of a double-sided PCB board are different from those of a single-sided PCB board. In addition to the production process, there is also a copper deposition process, which is the process of conducting the double-sided circuit.