Double-Sided PCB Boards from China Suppliers | High-Quality Circuit Boards Factory for Various Industries
Process Editing
Double-sided printed boards are usually made of epoxy glass cloth copper foil. It is mainly used for communication electronics with high performance requirements equipment, advanced instruments, and electronic computers, etc.
Sampling
The most commonly used method for double-sided PCB sampling is the process. At the same time, rosin process, OSP process, gold plating process, gold deposition, and silver plating processes are also applicable in double-sided boards.
Good appearance, silver white solder pad, easy to solder, and low price.
Stable quality, usually used in the presence of bonding ICs.
Distinguishing content
The difference between a double-sided PCB board and a single-sided PCB board is that the single panel circuit is only on one side of the PCB board, while the circuit of a double-sided PCB board can be connected between the two sides of the PCB board with a through hole in the middle.
The parameters of a double-sided PCB board are different from those of a single-sided PCB board. In addition to the production process, there is also a copper deposition process, which is the process of conducting the double-sided circuit.
Double-sided printed circuit boards are typically made from epoxy glass cloth copper foil, which provides excellent durability and performance for advanced applications.
The primary production methods include the process wire method, hole blocking method, masking method, and the graphic electroplating etching method.
Common processes used in double-sided PCB sampling include the tin spraying process, rosin process, OSP process, gold plating process, gold deposition, and silver plating processes.
A single-sided PCB has circuits on only one side of the board. In contrast, a double-sided PCB has circuits on both sides that are connected through holes in the middle.
The copper deposition process is a vital manufacturing step used to make the through-holes conductive, allowing electrical connections between the two sides of the double-sided board.
While the tin spraying process is popular for its easy soldering and lower cost, the tin metal process offers stable quality and is typically used when bonding ICs are present.