China Multilayer Printed Circuit Boards - Quality Suppliers and Factory for Advanced PCB Solutions
Characteristics of PCB Multilayer Board
The biggest difference between a multi layer PCB board and a single or double panel is the addition of an internal power layer (maintaining the internal power layer) and a grounding layer. The power and ground network are mainly wired on the power layer. However, multi-layer board wiring is mainly based on the top and bottom layers, supplemented by the middle wiring layer. Therefore, the design method of multi-layer boards is basically the same as that of double-sided boards, and the key lies in how to optimize the wiring of the internal electrical layer to make the wiring of the circuit board more reasonable and have better electromagnetic compatibility.
Process Flow of PCB Multilayer Board
Process Flow
Printed circuit board upper board with completed graphics
→
acidic degreasing
→
scanning water washing
→
secondary countercurrent water washing
→
micro etching
→
scanning water washing
→
secondary countercurrent water washing
→
copper plating prepreg
→
copper plating
→
scanning water washing
→
tin plating prepreg
→
tin plating
→
secondary countercurrent water washing
→
lower board
The difference between a double-sided PCB board and a single-sided PCB board is that the single panel circuit is only on one side of the PCB board, while the circuit of a double-sided PCB board can be connected between the two sides of the PCB board with a through hole in the middle.
Product Parameters
| Feature | AREX´s technical specification |
| Number of layers | 4 – 22 layers standard, 30 layers advanced, 40 layers prototype. |
| Technology highlights | Multiple layers of epoxy glass fiber bonded together with multiple layers of copper of varying thicknesses. |
| Materials | High performance FR4, halogen-free FR4, low loss and low Dk materials |
| Copper weights (finished) | 18μm – 210μm, advanced 1050μm / 30oz |
| Minimum track and gap | 0.075mm / 0.075mm |
| PCB thickness | 0.40mm – 7.0mm |
| Maximum dimensions | 580mm x 1080mm, advanced 610mm x 1400mm |
| Surface finishes available | HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers |
| Minimum mechanical drill | 0.20mm |
| Minimum laser drill | 0.10mm standard, 0.075mm advanced |
Frequently Asked Questions (FAQ)
What is the main difference between a multilayer PCB and a single or double-sided PCB?
The primary difference is the addition of internal power and grounding layers. Unlike single or double-sided boards, multilayer PCBs route power and ground networks mainly on these internal layers, which optimizes wiring and significantly improves electromagnetic compatibility.
What is the typical manufacturing process flow for multilayer PCBs?
The process flow begins with the completed graphics on the board, followed by acidic degreasing, micro etching, copper plating, and tin plating. Each critical chemical step is separated by thorough water washing and countercurrent water washing before the board is finalized.
How many layers can be manufactured in a multilayer PCB?
Standard production supports 4 to 22 layers. Advanced designs can reach up to 30 layers, and prototype boards can be manufactured with up to 40 layers.
What materials and surface finishes are available for multilayer boards?
Common materials include high-performance FR4, halogen-free FR4, and low-loss/low Dk materials. Available surface finishes include HASL, LF HASL, OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, and Gold fingers.
What are the drilling limitations for multilayer PCBs?
The minimum mechanical drill size is 0.20mm. For high-density interconnects, laser drilling supports a minimum diameter of 0.10mm for standard specifications and 0.075mm for advanced requirements.