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China Metal Insulation Base Printed Circuit Boards - High-Quality Suppliers & Factory Solutions

The metal insulation substrate is an advanced metal circuit board material that integrates a metal base layer, an insulating layer, and a copper clad circuit layer. Manufactured by leading suppliers in China, this innovative product is designed for optimal performance in electronic applications, Featuring a unique combination of thermal insulation, magnetic conductivity, and excellent heat dissipation, the metal insulation substrate boasts high mechanical strength and superior processing capabilities. The top layer consists of a copper clad circuit layer that can be precisely etched to create required circuit patterns, allowing for direct soldering of essential components such as power transistors and driver control chips, To ensure reliable soldering and to prevent oxidation, the solder pads are treated with Ti, Pt, Cu, Au, and other thin gold films, available in thicknesses of 35, 50, 70, 105, and 140 microns. The insulating medium layer, typically constructed from epoxy glass fiber cloth adhesive with excellent thermal conductivity, epoxy resin, or ceramic-filled organic dielectric film, comes in thicknesses of 50, 75, 100, and 150 microns, As a trusted factory in China, we provide high-quality metal insulation substrates suitable for various electronic components, ensuring your projects benefit from the best materials available

    Features

    Special magnetic conductivity
    Excellent heat dissipation
    High mechanical strength
    Good processing performance

    Applications

    Applied in various high-performance floppy disk drives, brushless DC motors for computers, motors for fully automatic cameras, and some cutting-edge military technology products.

    IMS – Insulated Metal Base Printed Circuit Boards
    IMS – Insulated Metal Base Printed Circuit Boards

    Product Parameters

    Feature AREX's Technical Specification
    Number of layers 1 – 4 layers
    Technology highlights Effective heat sink solutions for thermal applications. This construction type enables superior heat dissipation through use of either aluminium or copper substrate bonded to the insulated circuitry through thermal pre-preg or resin systems.
    Materials Aluminium & copper plates. FR-4, PTFE, thermal dielectrics.
    Dielectric thickness 0.05mm – 0.20mm
    Thermal conductivity 1-12 W/m/K
    Profile method Punching, Liquid cooled routing
    Copper weights (finished) 35μm – 140μm
    Minimum track and gaps 0.10mm / 0.10mm
    Metal core thickness 0.40mm – 3.20mm
    Maximum dimensions 550mm x 700mm
    Surface finishes available HASL, LF HASL, OSP, ENIG, Immersion tin, Immersion silver
    Minimum mechanical drill 0.30mm
    Minimum laser drill 0.10mm standard, 0.075mm advanced

    Frequently Asked Questions

    What are the core features of these Insulated Metal Base PCBs?
    These boards feature special magnetic conductivity, excellent heat dissipation, high mechanical strength, and good processing performance, making them ideal for demanding thermal applications.
    What primary applications are these PCBs designed for?
    They are widely applied in high-performance floppy disk drives, brushless DC motors for computers, automatic camera motors, and advanced military technology products.
    What is the range of thermal conductivity offered?
    The thermal conductivity of our Insulated Metal Base PCBs ranges from 1 to 12 W/m/K, providing highly effective heat sink solutions.
    What materials are used for the metal core substrates?
    We utilize aluminium and copper plates, combined with FR-4, PTFE, and high-quality thermal dielectrics to ensure superior structural and thermal integrity.
    What are the maximum board dimensions available?
    The maximum manufacturing dimensions for these Insulated Metal Base PCBs are 550mm x 700mm, with metal core thicknesses ranging from 0.40mm to 3.20mm.