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China Insulated Metal Base Printed Circuit Boards - Top Suppliers & Factory for High-Quality PCB Solutions

The metal insulation substrate is a high-performance metal circuit board material that integrates a metal base layer, an insulation layer, and a copper clad circuit layer. As one of the essential electronic components, it boasts unique magnetic conductivity, superior heat dissipation, high mechanical strength, and excellent processing capabilities, This substrate features a copper clad circuit layer that can be intricately designed according to electrical interconnection requirements, allowing for precise corrosion into the needed circuit patterns. Power transistors, driver control chips, and other critical components can be directly soldered onto this copper layer. To enhance soldering and prevent oxidation, the solder pads are coated with thin films of materials such as Ti, Pt, Cu, and Au, with thickness options ranging from 35 to 140 microns, The insulating medium layer, typically made from epoxy glass fiber cloth, epoxy resin, or organic dielectric films filled with ceramic materials, ensures efficient thermal conductivity. This layer comes in various thickness specifications of 50, 75, 100, and 150 microns, As a leading supplier and factory based in China, we provide high-quality metal insulation substrates that meet diverse industrial needs, ensuring exceptional performance and reliability for your electronic applications

    Features

    Magnetic Conductivity

    Special magnetic conductivity optimized for high-performance applications.

    Heat Dissipation

    Excellent thermal management and heat dissipation capabilities.

    Mechanical Strength

    High mechanical strength ensures durability under rigorous conditions.

    Processing Performance

    Good processing and machining performance for precise manufacturing.

    Applications

    Applied in various high-performance floppy disk drives, brushless DC motors for computers, motors for fully automatic cameras, and some cutting-edge military technology products.

    Product Parameters

    Feature AREX's Technical Specification
    Number of layers 1 – 4 layers
    Technology highlights Effective heat sink solutions for thermal applications. This construction type enables superior heat dissipation through use of either aluminium or copper substrate bonded to the insulated circuitry through thermal pre-preg or resin systems.
    Materials Aluminium & copper plates. FR-4, PTFE, thermal dielectrics.
    Dielectric thickness 0.05mm – 0.20mm
    Thermal conductivity 1-12 W/m/K
    Profile method Punching, Liquid cooled routing
    Copper weights (finished) 35μm – 140μm
    Minimum track and gaps 0.10mm / 0.10mm
    Metal core thickness 0.40mm – 3.20mm
    Maximum dimensions 550mm x 700mm
    Surface finishes available HASL, LF HASL, OSP, ENIG, Immersion tin, Immersion silver
    Minimum mechanical drill 0.30mm
    Minimum laser drill 0.10mm standard, 0.075mm advanced

    Frequently Asked Questions

    Q: What are the primary features of IMS (Insulated Metal Base) PCBs?

    IMS PCBs provide special magnetic conductivity, excellent heat dissipation, high mechanical strength, and outstanding processing performance for demanding applications.

    Q: What typical applications use these metal base PCBs?

    They are commonly used in high-performance floppy disk drives, brushless DC motors for computers, automatic camera motors, and advanced military technology products.

    Q: What is the range of thermal conductivity offered by AREX's IMS PCBs?

    Our IMS PCBs offer a high thermal conductivity range of 1 to 12 W/m/K, providing highly effective heat sink solutions for thermal applications.

    Q: What materials and substrates are available for construction?

    We utilize aluminium and copper plates as base substrates, combined with FR-4, PTFE, and specialized thermal dielectrics to meet different thermal requirements.

    Q: What are the layer capabilities and maximum dimensions?

    We support configurations from 1 to 4 layers, with metal core thicknesses ranging from 0.40mm to 3.20mm and maximum board dimensions up to 550mm x 700mm.

    Q: What surface finishes can be applied to these boards?

    Available surface finishes include HASL, Lead-Free HASL, OSP, ENIG, Immersion Tin, and Immersion Silver to ensure optimal solderability and shelf life.