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China Insulated Metal Base Printed Circuit Boards - Top Suppliers and Factory for High Performance Solutions

The metal insulation substrate is an advanced electronic component consisting of a metal base layer, an insulation layer, and a copper clad circuit layer, making it a crucial material for modern circuit boards. Manufactured in China by reliable suppliers and factories, this substrate features exceptional magnetic conductivity, outstanding heat dissipation, and high mechanical strength, ensuring excellent processing performance, At the top of the substrate is a copper clad circuit layer, initially comprising a copper layer that can be precision-etched to meet specific electrical interconnection requirements. This allows for direct soldering of power transistors, core chips, and driver control chips onto the copper layer. To enhance soldering ease and prevent oxidation, the solder pads are coated with thin films of Ti, Pt, Cu, Au, and other materials with thicknesses of 35, 50, 70, 105, and 140 microns, The insulating medium layer, located in the middle, is typically made from epoxy glass fiber cloth adhesive, epoxy resin, or organic dielectric films enriched with ceramic materials, all designed for excellent thermal conductivity. This insulation layer comes in four standard thicknesses: 50, 75, 100, and 150 microns, catering to various application needs, Choose our metal insulation substrates for reliable performance and quality sourced directly from China’s leading suppliers and factories

    Features

    Special magnetic conductivity, excellent heat dissipation, high mechanical strength, and good processing performance.

    Applications

    Applied in various high-performance floppy disk drives, brushless DC motors for computers, motors for fully automatic cameras, and some cutting-edge military technology products.

    Product Parameters

    Feature AREX's Technical Specification
    Number of layers 1 – 4 layers
    Technology highlights Effective heat sink solutions for thermal applications. This construction type enables superior heat dissipation through use of either aluminium or copper substrate bonded to the insulated circuitry through thermal pre-preg or resin systems.
    Materials Aluminium & copper plates. FR-4, PTFE, thermal dielectrics.
    Dielectric thickness 0.05mm – 0.20mm
    Thermal conductivity 1-12 W/m/K
    Profile method Punching, Liquid cooled routing
    Copper weights (finished) 35μm – 140μm
    Minimum track and gaps 0.10mm / 0.10mm
    Metal core thickness 0.40mm – 3.20mm
    Maximum dimensions 550mm x 700mm
    Surface finishes available HASL, LF HASL, OSP, ENIG, Immersion tin, Immersion silver
    Minimum mechanical drill 0.30mm
    Minimum laser drill 0.10mm standard, 0.075mm advanced

    Frequently Asked Questions

    Q:What are the key features of Insulated Metal Base PCBs (IMS)?

    These boards feature special magnetic conductivity, excellent heat dissipation, high mechanical strength, and good processing performance, making them ideal for high-thermal applications.

    Q:What are the main applications for these metal base printed circuit boards?

    They are widely used in high-performance floppy disk drives, brushless DC motors for computers, automatic camera motors, and cutting-edge military technology products.

    Q:What range of thermal conductivity do you support?

    We offer a thermal conductivity range from 1 up to 12 W/m/K, allowing for tailored thermal management configurations depending on your project requirements.

    Q:What materials are used for the metal core substrate?

    Our IMS PCBs utilize aluminium and copper plates combined with FR-4, PTFE, and high-performance thermal dielectrics to optimize heat transfer.

    Q:What surface finishes are available for these circuit boards?

    We support multiple surface finishes including HASL, Lead-Free HASL, OSP, ENIG (Electroless Nickel Immersion Gold), Immersion Tin, and Immersion Silver.

    Q:What is the maximum layer count and dimensions for custom orders?

    We manufacture metal base PCBs in 1 to 4 layer configurations with maximum board dimensions of up to 550mm x 700mm.